Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum

JOM

Volumn 56, Issue 6, 2004, Pages 45-49

  Kim, Tae Hyun ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); INTERMETALLICS; LIQUID METALS; PLATINUM; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; SURFACE REACTIONS; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS;

INTERFACIAL REACTIONS; INTERMETALLIC SOLDERS; MOLTEN SOLDER; TIN SILVER COPPER SOLDERS;

SOLDERING ALLOYS;

EID: 3242808300     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-004-0111-9     Document Type: Article

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