Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element

Journal of Applied Physics

Volumn 101, Issue 8, 2007, Pages

  Yang, S C ^a   Ho, C E ^a   Chang, C W ^a   Kao, C R ^b  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

EXTRACTION; INTERFACES (MATERIALS); SOLDERING; THERMODYNAMICS; TIN COMPOUNDS;

ACTIVE ELEMENTS; REACTIVE CONSTITUENTS; SOLDER-SUBSTRATE REACTIONS;

INTERMETALLICS;

EID: 34247579720     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2717564     Document Type: Article

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