A New Ni-Zn under bump metallurgy for Pb-free solder bump flip chip application

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 151-155

  Cho, Hae Young ^a   Kim, Tae Jin ^a   Kim, Young Min ^a   Kim, Sun Chul ^a   Park, Jin Young ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGING TIME; CONSUMPTION RATES; CONVENTIONAL MAGNETRON SPUTTERING; CURVATURE METHOD; FILM STRESS; FLIP CHIP APPLICATIONS; IMC THICKNESS; INTER-DIFFUSION; INTERMETALLIC COMPOUNDS; PB FREE SOLDERS; PB-FREE SOLDER BUMP; SI WAFER; UNDER-BUMP METALLURGIES;

GOLD ALLOYS; LEAD; METALLURGY; SEMICONDUCTING INTERMETALLICS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SOLDERING; SOLDERING ALLOYS; ZINC;

TIN;

EID: 77955208037     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490894     Document Type: Conference Paper

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