Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn-Cu solder alloy

Advances in Colloid and Interface Science

Volumn 166, Issue 1-2, 2011, Pages 87-118

  Satyanarayan, ^a   Prabhu, K N ^a  

^a NATIONAL INSTITUTE OF TECHNOLOGY KARNATAKA   (India)

Author keywords

Contact angle; IMC; Reactive wetting; Sn 0.7Cu lead free solder

Indexed keywords

BULK SOLDER; COOLING RATES; ELECTRONIC APPLICATION; ELECTRONIC PACKAGING; FRACTURE BEHAVIOR; GROWTH MECHANISMS; IMC; LEAD FREE SOLDERS; LEAD-FREE ALLOY; LIQUID SOLDERS; MECHANICAL BEHAVIOR; METALLIC SUBSTRATE; REACTIVE WETTING; SN-0.7CU LEAD-FREE SOLDER; SN-0.7CU SOLDER; SN-CU SOLDERS; SOLDER ALLOYS; SOLDER JOINTS; STANDARD PROCEDURES; WAVE SOLDERING; WETTING BEHAVIOR;

CERIUM ALLOYS; CHIP SCALE PACKAGES; CONTACT ANGLE; COPPER ALLOYS; EUTECTICS; FRACTURE; INTERMETALLICS; LEAD COMPOUNDS; MECHANICAL PROPERTIES; MECHANISMS; SHEAR FLOW; SHEAR STRENGTH; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; STRAIN RATE; SUBSTRATES; TENSILE STRENGTH; TIN ALLOYS; WETTING;

TIN;

EID: 79959965997     PISSN: 00018686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cis.2011.05.005     Document Type: Review

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