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Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics

Volumn , Issue , 2007, Pages 39-54

The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints

(1) Swenson, D a

a Michigan Technological University (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84892781042 PISSN: None EISSN: None Source Type: Book
DOI: 10.1007/978-0-387-48433-4_3 Document Type: Chapter

Times cited : (7)

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