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Volumn 59, Issue 7, 2007, Pages 38-43

Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; BRAZING; COPPER; COPPER ALLOYS; EPITAXIAL GROWTH; IRON; LITHOGRAPHY; NICKEL; NUCLEATION; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS; WELDING; ZINC;

EID: 47049116123     PISSN: 10474838     EISSN: 15431851     Source Type: Journal    
DOI: 10.1007/s11837-007-0087-3     Document Type: Article
Times cited : (41)

References (15)
  • 1
    • 47049088636 scopus 로고    scopus 로고
    • Ford Motor Company, Dearborn, Michigan, private communication 12 February
    • T. Pan, Ford Motor Company, Dearborn, Michigan, private communication (12 February 2001).
    • (2001)
    • Pan, T.1
  • 2
    • 10644231004 scopus 로고    scopus 로고
    • Effect of Thermal Aging on Board Level Drop Reliability for Pb-free BGA Packages
    • Piscataway, NJ: IEEE
    • T-C. Chiu et al., "Effect of Thermal Aging on Board Level Drop Reliability for Pb-free BGA Packages," Proceedings of the 54th Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 2004), pp. 1256-1262.
    • (2004) Proceedings of the 54th Electronic Components and Technology Conference , pp. 1256-1262
    • Chiu, T.-C.1
  • 3
    • 0038487318 scopus 로고    scopus 로고
    • 3Sn Plate Formation in the Solidification of Near-Ternary
    • 3Sn Plate Formation in the Solidification of Near-Ternary" JOM, 55 (6) (2003), pp. 61-65.
    • (2003) JOM , vol.55 , Issue.6 , pp. 61-65
    • Kang, S.K.1
  • 4
    • 0037323121 scopus 로고    scopus 로고
    • Physics and Materials for Lead-free Solders
    • K.N. Tu, A.M. Gusak, and M. Li, "Physics and Materials for Lead-free Solders," J. Appl. Phys., 93 (3) (2003), pp. 1335-1353.
    • (2003) J. Appl. Phys , vol.93 , Issue.3 , pp. 1335-1353
    • Tu, K.N.1    Gusak, A.M.2    Li, M.3
  • 5
    • 11344295794 scopus 로고    scopus 로고
    • Elevated Temperature Aging of Solder Joints Based on Sn-Ag-Cu: Effects on Joint Microstructure and Shear Strength
    • I.E. Anderson and J.L. Harringa, "Elevated Temperature Aging of Solder Joints Based on Sn-Ag-Cu: Effects on Joint Microstructure and Shear Strength," J. Electron. Mater., 33 (2004), pp. 1485-1496.
    • (2004) J. Electron. Mater , vol.33 , pp. 1485-1496
    • Anderson, I.E.1    Harringa, J.L.2
  • 6
    • 4944219736 scopus 로고    scopus 로고
    • Solid-State Intermetallic Compound Layer Growth Between Copper and 95.5Sn-3.9Ag-0.6Cu Solder
    • P.T. Vianco, J.A. Rejent, and P.F. Hlava, "Solid-State Intermetallic Compound Layer Growth Between Copper and 95.5Sn-3.9Ag-0.6Cu Solder," J. Electron. Mater., 33 (2004), p. 991.
    • (2004) J. Electron. Mater , vol.33 , pp. 991
    • Vianco, P.T.1    Rejent, J.A.2    Hlava, P.F.3
  • 7
    • 33947314489 scopus 로고    scopus 로고
    • 3Sn Interface in Flip-Chip Cu/Sn/Cu Joints, Appl. Phys. Lett., 90 (2007), p. 112114.
    • 3Sn Interface in Flip-Chip Cu/Sn/Cu Joints," Appl. Phys. Lett., 90 (2007), p. 112114.
  • 8
    • 33845694955 scopus 로고    scopus 로고
    • Development of Sn-Ag-Cu and Sn-Ag-Cu-X Alloys for Pb-Free Electronic Solder Applications
    • I.E. Anderson, "Development of Sn-Ag-Cu and Sn-Ag-Cu-X Alloys for Pb-Free Electronic Solder Applications," J. Mater. Sci., Mater. Electron., 18 (2007), pp. 55-76.
    • (2007) J. Mater. Sci., Mater. Electron , vol.18 , pp. 55-76
    • Anderson, I.E.1
  • 9
    • 3242806751 scopus 로고    scopus 로고
    • 3Sn Plate Formation in Near-Ternary Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying
    • 3Sn Plate Formation in Near-Ternary Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying," JOM, 56 (6) (2004), pp. 34-38.
    • (2004) JOM , vol.56 , Issue.6 , pp. 34-38
    • Kang, S.K.1
  • 10
    • 0034297162 scopus 로고    scopus 로고
    • Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloys
    • K.-W. Moon et al., "Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloys," J. Electron. Mater., 29 (2000), p. 1122.
    • (2000) J. Electron. Mater , vol.29 , pp. 1122
    • Moon, K.-W.1
  • 11
    • 0036612353 scopus 로고    scopus 로고
    • Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties
    • I.E. Anderson et al., "Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties," JOM, 54 (6) (2002), pp. 26-29.
    • (2002) JOM , vol.54 , Issue.6 , pp. 26-29
    • Anderson, I.E.1
  • 12
    • 0020891294 scopus 로고
    • Nucleation Aspects of Grain Refinement
    • ed. G.J. Abbaschian and S.A. David Warrendale, PA: TMS
    • I.E. Anderson and J.H. Perepezko, "Nucleation Aspects of Grain Refinement," Grain Refinement in Castings and Welds, ed. G.J. Abbaschian and S.A. David (Warrendale, PA: TMS, 1983), pp. 67-86.
    • (1983) Grain Refinement in Castings and Welds , pp. 67-86
    • Anderson, I.E.1    Perepezko, J.H.2
  • 13
    • 33751398199 scopus 로고    scopus 로고
    • Beneficial Alloy Effects in Tin-Silver-Copper-X Solder Joints for High Temperature Applications
    • ed. J.J. Stephens and K.S. Weil Materials Park, OH: ASM International
    • I.E. Anderson and J.L. Harringa, "Beneficial Alloy Effects in Tin-Silver-Copper-X Solder Joints for High Temperature Applications," Brazing and Soldering, Proceedings of the 3rd International Brazing and Soldering Conference, ed. J.J. Stephens and K.S. Weil (Materials Park, OH: ASM International, 2006), pp. 18-25.
    • (2006) Brazing and Soldering, Proceedings of the 3rd International Brazing and Soldering Conference , pp. 18-25
    • Anderson, I.E.1    Harringa, J.L.2
  • 14
    • 0035455514 scopus 로고    scopus 로고
    • Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability
    • I.E. Anderson et al., "Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability," J. Electron. Mater., 30 (2001), p. 1050.
    • (2001) J. Electron. Mater , vol.30 , pp. 1050
    • Anderson, I.E.1
  • 15
    • 47049112520 scopus 로고    scopus 로고
    • Freescale Semiconductor, Tempe, Arizona, private communication 25 February
    • D.R. Frear, Freescale Semiconductor, Tempe, Arizona, private communication (25 February 2007).
    • (2007)
    • Frear, D.R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.