The interfacial reaction between Sn-Ag alloys and Co substrate

Materials Science and Engineering: A

Volumn 456, Issue 1-2, 2007, Pages 109-113

  Zhu, WenJun ^a   Wang, Jiang ^a   Liu, HuaShan ^a   Jin, ZhanPeng ^a   Gong, WeiPing ^b  

^a CENTRAL SOUTH UNIVERSITY   (China)

^b Institute of HuiZhou   (China)

Author keywords

Co substrate; Diffusion; Interfacial reaction; Sn Ag alloy

Indexed keywords

ANNEALING; COBALT; DIFFUSION; INTERFACES (MATERIALS); INTERMETALLICS; NUCLEATION; SUBSTRATES; SURFACE CHEMISTRY;

BINARY SYSTEM; DIFFUSION-CONTROLLED MECHANISM;

TIN ALLOYS;

ANNEALING; COBALT; DIFFUSION; INTERFACES (MATERIALS); INTERMETALLICS; NUCLEATION; SUBSTRATES; SURFACE CHEMISTRY; TIN ALLOYS;

EID: 33947409590     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.11.117     Document Type: Article

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