Nanoparticle enhanced solders for high temperature environments

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 109-113

  Ashayer, Roya ^a   Mannan, Samjid H ^a   Sajjadi, Shahriar ^a   Clode, Mike P ^a   Miodownik, Mark M ^a  

^a KING'S COLLEGE LONDON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

AIR; AMMONIUM COMPOUNDS; COMPUTATIONAL FLUID DYNAMICS; DYNAMICS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FLUID DYNAMICS; FLUID MECHANICS; GOLD; MATERIALS PROPERTIES; NANOPARTICLES; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; SHELLS (STRUCTURES); SILICA; SILICATE MINERALS; SILICON COMPOUNDS; SOLDERING ALLOYS; TECHNOLOGY; WELDING;

3-AMINOPROPYLTRIMETHOXYSILANE; AMMONIUM CHLORIDES; DIELECTRIC CORES; HIGH-TEMPERATURE ENVIRONMENTS; LINKER MOLECULES; PACKAGING TECHNOLOGIES; REFLOW PROCESS; RELIABILITY PROPERTIES; SOLDER PARTICLES; SOLDER PASTES; SYNTHESIS ROUTES;

BRAZING;

EID: 50049118588     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469800     Document Type: Conference Paper

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