Microstructural and mechanical properties of Sn-Ag-Cu lead-free solders with minor addition of Ni and/or Co

Journal of Materials Science

Volumn 43, Issue 10, 2008, Pages 3643-3648

  Cheng, Fangjie ^a,b   Nishikawa, Hiroshi ^a   Takemoto, Tadashi ^a  

^a OSAKA UNIVERSITY   (Japan)

^b TIANJIN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; ADDITIVES; GRAIN SIZE AND SHAPE; MICROSTRUCTURE;

MICROSTRUCTURAL CHANGES; UNDERCOOLING SUPPRESSION;

SOLDERING ALLOYS;

EID: 42149090583     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-008-2580-7     Document Type: Conference Paper

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