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Volumn 31, Issue 20, 1996, Pages 5479-5486

Compound growth in platinum/tin-lead solder diffusion couples

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; DIFFUSION IN SOLIDS; INTERMETALLICS; LEAD; PLATINUM; SCANNING ELECTRON MICROSCOPY; TIN;

EID: 0030261881     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF01159320     Document Type: Article
Times cited : (18)

References (15)
  • 2
    • 0004106207 scopus 로고
    • Solder Mechanics - A State-of-the-Art Assessment
    • TMS, Warrendale, PA
    • D. R. FREAR, W. B. JONES and K. R. KINSMAN (eds), "Solder Mechanics - A State-of-the-Art Assessment" TMS-EMPMD Monograph Series, Vol. 1 (TMS, Warrendale, PA, 1991).
    • (1991) TMS-EMPMD Monograph Series , vol.1
    • Frear, D.R.1    Jones, W.B.2    Kinsman, K.R.3
  • 3
    • 25644442968 scopus 로고
    • Trans. Tech, Bay Village, OH
    • "Diffusion and Defect Data" (Trans. Tech, Bay Village, OH, (1967-1981).
    • (1967) Diffusion and Defect Data
  • 10
    • 25644459086 scopus 로고
    • Master's thesis, Stevens Institute of Technology
    • B. W. MEAGHER, Master's thesis, Stevens Institute of Technology (1991).
    • (1991)
    • Meagher, B.W.1
  • 15
    • 25644454853 scopus 로고
    • edited by F. J. Kedves and D. L. Beke Trans. Tech. Switzerland
    • C. HERZIG, in "DIMETA-82 Diffusion in Metals and Alloys", edited by F. J. Kedves and D. L. Beke (Trans. Tech. Switzerland, 1983) p. 24.
    • (1983) DIMETA-82 Diffusion in Metals and Alloys , pp. 24
    • Herzig, C.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.