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Volumn 31, Issue 20, 1996, Pages 5479-5486
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Compound growth in platinum/tin-lead solder diffusion couples
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Author keywords
[No Author keywords available]
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Indexed keywords
ACTIVATION ENERGY;
DIFFUSION IN SOLIDS;
INTERMETALLICS;
LEAD;
PLATINUM;
SCANNING ELECTRON MICROSCOPY;
TIN;
DIFFUSION COUPLES;
PLATINUM-TIN-LEAD SOLDER;
SOLID-STATE COMPOUND GROWTH;
SOLDERING;
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EID: 0030261881
PISSN: 00222461
EISSN: None
Source Type: Journal
DOI: 10.1007/BF01159320 Document Type: Article |
Times cited : (18)
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References (15)
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