Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys

Journal of Materials Research

Volumn 20, Issue 11, 2005, Pages 2914-2918

  Kinyanjui, R ^a   Lehman, L P ^a   Zavalij, L ^a   Cotts, E ^a  

^a State University of New York at Binghamton   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; EUTECTICS; HEAT TRANSFER; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; SOLIDIFICATION;

MECHANICAL RESPONSE; SOLDER BALLS; TIN DENDRITE ARM;

TIN ALLOYS;

EID: 33645453111     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0361     Document Type: Article

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