'Effects of Minor Alloying Additions on the Properties and Reliability of Pb-Free Solders and Joints'

Lead-free Solders: Materials Reliability for Electronics

Volumn , Issue , 2012, Pages 120-159

  Kang, Sung K ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Ag3Sn plate control; C4 new process; EM in Pb free; Microalloying; Minor alloying additions; Pb free solder applications; Pb free solder development; Sn rich solders; Solder joint microstructure

Indexed keywords

ALLOYING; BINARY ALLOYS; ELECTRONICS INDUSTRY; IMPACT RESISTANCE; MICROALLOYING; MICROSTRUCTURE; RELIABILITY; SILVER ALLOYS; SOLDERED JOINTS; TIN ALLOYS; TOXIC MATERIALS;

ALLOY ADDITIONS; ELECTRONIC SYSTEMS; FLIP-CHIP INTERCONNECTION; MINOR ALLOYING; PB-FREE; RELIABILITY REQUIREMENTS; RESEARCH AND DEVELOPMENT; SOLDER JOINT MICROSTRUCTURE;

LEAD-FREE SOLDERS;

EID: 84957092898     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9781119966203.ch5     Document Type: Chapter

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