Interfacial reaction between molten Sn-Bi based solders and electroless Ni-p coatings for liquid solder interconnects

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 3, 2008, Pages 574-585

  Li, Jianfeng ^a   Mannan, Samjid H ^a   Clode, Mike P ^a   Liu, Chongqing ^b   Chen, Keming ^b   Whalley, David C ^b   Hutt, David A ^b   Conway, Paul P ^b  

^a KING'S COLLEGE LONDON   (United Kingdom)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Coatings; High temperature electronics; Interfaces; Liquid solder interconnects; Metallization; Scanning electron microscopy (SEM)

Indexed keywords

BRAZING; CHROMIUM; COPPER; INTERMETALLICS; NICKEL; NICKEL ALLOYS; NIOBIUM; PLATINUM; SILICON; SILVER; SOLDERING ALLOYS; WELDING; ZINC;

COATINGS; HIGH-TEMPERATURE ELECTRONICS; INTERFACES; LIQUID SOLDER INTERCONNECTS; METALLIZATION; SCANNING ELECTRON MICROSCOPY (SEM);

TIN;

EID: 54849377300     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2001160     Document Type: Article

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