SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 1, 2009, Pages 25-32

Interfacial reaction and wetting behavior between Pt and molten solder

(4) Yang, S C a Chang, W C a Wang, Y W a Kao, C R a

a NATIONAL TAIWAN UNIVERSITY (Taiwan)

Author keywords

Diffusion; Dissolution; Intermetallic; Nickel; Platinum

Indexed keywords

BARRIER LAYERS; CHIP DEVICES; DIFFUSION BARRIER LAYERS; DISSOLUTION RATES; INTERFACIAL REACTIONS; MOLTEN SOLDERS; OXIDATION PROTECTIONS; TOP SURFACES; UNDERBUMP METALLURGIES; WETTING BEHAVIORS; WETTING CHARACTERISTICS; WETTING PROPERTIES;

BRAZING; DIFFUSION; FLIP CHIP DEVICES; INDUSTRIAL APPLICATIONS; METAL RECOVERY; METALLURGY; NICKEL; NICKEL ALLOYS; PLATINUM; REACTION RATES; SOLDERING ALLOYS; TIN; WELDING; WETTING;

DISSOLUTION;

EID: 57649228423 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0541-1 Document Type: Conference Paper

Times cited : (14)

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