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Volumn 39, Issue 8, 2010, Pages 1303-1308
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Coupling effect of the interfacial reaction in Co/Sn/Cu diffusion couples
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Author keywords
Co; Cu; Interfacial reactions; Lead free solders
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Indexed keywords
COUPLING EFFECT;
CU SUBSTRATE;
DIFFUSION COUPLE;
INTERFACIAL REACTIONS;
LEAD FREE SOLDERS;
REACTION LAYERS;
TWO PHASIS;
LEAD;
PHASE INTERFACES;
TIN;
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EID: 77954622529
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-010-1180-x Document Type: Article |
Times cited : (15)
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References (18)
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