Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate

Journal of Electronic Materials

Volumn 33, Issue 12, 2004, Pages 1497-1506

  Qi, Y ^a   Zbrzezny, A R ^a   Agia, M ^b   Lam, R ^a   Ghorbani, H R ^a   Snugovsky, P ^c   Perovic, D D ^a   Spelt, J K ^a  

^a UNIVERSITY OF TORONTO   (Canada)

^b Digital Security Controls Ltd   (Canada)

^c Celestica Inc   (Canada)

Author keywords

Finite element model; Lead free; Leadless chip resistor (LCR); Reflow; Thermal fatigue

Indexed keywords

COOLING; FAILURE ANALYSIS; FINITE ELEMENT METHOD; RESISTORS; SCANNING ELECTRON MICROSCOPY; STRAIN; THERMAL CYCLING; THERMOANALYSIS; WETTING;

FINITE-ELEMENT MODEL; LEAD-FREE; LEADLESS CHIP RESISTORS (LCR); REFLOW; THERMAL FATIGUE;

SOLDERED JOINTS;

EID: 11344250405     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0091-0     Document Type: Conference Paper

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