SCOPUS 정보 검색 플랫폼

Journal of Applied Physics

Volumn 109, Issue 10, 2011, Pages

The interfacial amorphous double layer and the homogeneous nucleation in reflow of a Sn-Zn solder on Cu substrate

(2) Pan, Chien Cheng a Lin, Kwang Lung a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CU SUBSTRATE; DIFFUSION REGION; DOUBLE LAYERS; HIGH-RESOLUTION TRANSMISSION ELECTRON MICROSCOPES; HOMOGENEOUS NUCLEATION; INTERFACIAL MICROSTRUCTURE; NANOCRYSTALLINES; SN-ZN SOLDER;

GALLIUM; GALLIUM ALLOYS; INTERMETALLICS; LIQUID NITROGEN; NUCLEATION; SOLDERING ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; ZINC;

TIN;

EID: 79958841023 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.3592182 Document Type: Conference Paper

Times cited : (5)

References (30)

1
- 0004256317
- (Newnes, Oxford, United Kingdom)
- I. R. Strauss, SMT Soldering Handbook (Newnes, Oxford, United Kingdom, 1998), pp. 29-37.
- (1998) SMT Soldering Handbook , pp. 29-37
- Strauss, I.R.¹

2
- 0033221430
- 10.1007/s11664-999-0165-0
- J. Y. Park, C. S. Kang, and J. P. Jung, J. Electron. Mater. 28, 1256 (1999). 10.1007/s11664-999-0165-0
- (1999) J. Electron. Mater. , vol.28 , pp. 1256
- Park, J.Y.¹ Kang, C.S.² Jung, J.P.³

3
- 0033221845
- 10.1007/s11664-999-0155-2
- J. Sigelko, S. Choi, K. N. Subramanian, J. P. Lucas, and T. R. Bieler, J. Electron. Mater. 28, 1184 (1999). 10.1007/s11664-999-0155-2
- (1999) J. Electron. Mater. , vol.28 , pp. 1184
- Sigelko, J.¹ Choi, S.² Subramanian, K.N.³ Lucas, J.P.⁴ Bieler, T.R.⁵

4
- 0031102543
- 10.1016/S1359-6454(96)00253-4
- S. W. Yoon, J. R. Soh, H. M. Lee, and B. J. Lee, Acta Mater 45, 951 (1997). 10.1016/S1359-6454(96)00253-4
- (1997) Acta Mater , vol.45 , pp. 951
- Yoon, S.W.¹ Soh, J.R.² Lee, H.M.³ Lee, B.J.⁴

5
- 0036686543
- 10.1007/s11664-002-0196-2
- K. I. Chen and K. L. Lin, J. Electron. Mater. 31, 861 (2002). 10.1007/s11664-002-0196-2
- (2002) J. Electron. Mater. , vol.31 , pp. 861
- Chen, K.I.¹ Lin, K.L.²

6
- 0242336530
- 10.1007/s11664-003-0096-0
- K. I. Chen and K. L. Lin, J. Electron. Mater. 32, 1111 (2003). 10.1007/s11664-003-0096-0
- (2003) J. Electron. Mater. , vol.32 , pp. 1111
- Chen, K.I.¹ Lin, K.L.²

7
- 33646526806
- Microstructure and mechanical properties of Sn-8.55Zn-1Ag-XAI solder alloys
- DOI 10.2320/matertrans.46.42
- S. C. Cheng and K. L. Lin, Mat. Trans. 46, 42 (2005). 10.2320/matertrans.46.42 (Pubitemid 44123627)
- (2005) Materials Transactions , vol.46 , Issue.1 , pp. 42-47
- Cheng, S.-C.¹ Lin, K.-L.²

8
- 0035797072
- Tin-lead (SnPb) solder reaction in flip chip technology
- DOI 10.1016/S0927-796X(01)00029-8, PII S0927796X01000298
- K. N. Tu and K. Zeng, Mater. Sci. Eng. R. Rep. 34, 1 (2001). 10.1016/S0927-796X(01)00029-8 (Pubitemid 32536111)
- (2001) Materials Science and Engineering: R: Reports , vol.34 , Issue.1 , pp. 1-58
- Tu, K.N.¹ Zeng, K.²

9
- 0343897894
- 10.1007/s11664-999-0158-z
- S. W. Chen and Y. W. Yen, J. Electron. Mater. 28, 1203 (1999). 10.1007/s11664-999-0158-z
- (1999) J. Electron. Mater. , vol.28 , pp. 1203
- Chen, S.W.¹ Yen, Y.W.²

10
- 0032188151
- 10.1557/JMR.1998.0391
- K. Suganuma, K. Niihara, T. Shoutoku, and Y. Nakamura, J. Mater. Res. 13, 2859 (1998). 10.1557/JMR.1998.0391
- (1998) J. Mater. Res. , vol.13 , pp. 2859
- Suganuma, K.¹ Niihara, K.² Shoutoku, T.³ Nakamura, Y.⁴

11
- 0036865846
- 10.1007/s11664-002-0010-1
- R. Gagliano, G. Ghosh, and M. Fine, J. Electron. Mater. 31, 1195 (2002). 10.1007/s11664-002-0010-1
- (2002) J. Electron. Mater. , vol.31 , pp. 1195
- Gagliano, R.¹ Ghosh, G.² Fine, M.³

12
- 49749087635
- 10.1063/1.2973148
- C. C. Pan, C. H. Yu, and K. L. Lin, Appl. Phys. Lett. 93, 061912 (2008). 10.1063/1.2973148
- (2008) Appl. Phys. Lett. , vol.93 , pp. 061912
- Pan, C.C.¹ Yu, C.H.² Lin, K.L.³

13
- 0742303043
- 10.1007/s11664-004-0287-3
- C. M. Chuang, H. T. Hung, P. C. Liu, and K. L. Lin, J. Electron. Mater. 33, 7 (2004). 10.1007/s11664-004-0287-3
- (2004) J. Electron. Mater. , vol.33 , pp. 7
- Chuang, C.M.¹ Hung, H.T.² Liu, P.C.³ Lin, K.L.⁴

14
- 27644553870
- The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu
- DOI 10.1016/j.scriptamat.2005.09.033, PII S1359646205005890
- N. S. Liu and K. L. Lin, Scripta Mater. 54, 219 (2006). 10.1016/j.scriptamat.2005.09.033 (Pubitemid 41563315)
- (2006) Scripta Materialia , vol.54 , Issue.2 , pp. 219-224
- Liu, N.-S.¹ Lin, K.-L.²

15
- 57649157645
- 10.1007/s11664-008-0579-0
- R. S. Lai, K. L. Lin, and B. Salam, J. Electron. Mater. 38, 88 (2009). 10.1007/s11664-008-0579-0
- (2009) J. Electron. Mater. , vol.38 , pp. 88
- Lai, R.S.¹ Lin, K.L.² Salam, B.³

16
- 25444442912
- Early stage soldering reaction and interfacial microstructure formed between molten Sn-Zn-Ag solder and Cu substrate
- DOI 10.1557/JMR.2005.0155
- C. H. Yu and K. L. Lin, J. Mater. Res. 20, 1242 (2005). 10.1557/JMR.2005.0155 (Pubitemid 41787062)
- (2005) Journal of Materials Research , vol.20 , Issue.5 , pp. 1242-1249
- Yu, C.-H.¹ Lin, K.-L.²

17
- 31044447898
- The atomic-scale studies of the behavior of the crystal dissolution in a molten metal
- DOI 10.1016/j.cplett.2005.11.017, PII S0009261405017173
- C. H. Yu and K. L. Lin, Chem. Phys. Lett. 418, 433 (2006). 10.1016/j.cplett.2005.11.017 (Pubitemid 43121295)
- (2006) Chemical Physics Letters , vol.418 , Issue.4-6 , pp. 433-436
- Yu, C.-H.¹ Lin, K.-L.²

18
- 0141502507
- 10.1557/JMR.2003.0249
- S. C. Cheng and K. L. Lin, J. Mater. Res. 18, 1795 (2003). 10.1557/JMR.2003.0249
- (2003) J. Mater. Res. , vol.18 , pp. 1795
- Cheng, S.C.¹ Lin, K.L.²

19
- 0003459433
- (ASM, Metals Park, Ohio)
- R. Hultgren, P. D. Desai, D. T. Hawkins, M. Gleiser, and K. K. Kelley, Selected Values of the Thermodynamic Properties of Binary Alloy (ASM, Metals Park, Ohio, 1973), p. 742.
- (1973) Selected Values of the Thermodynamic Properties of Binary Alloy , pp. 742
- Hultgren, R.¹ Desai, P.D.² Hawkins, D.T.³ Gleiser, M.⁴ Kelley, K.K.⁵

20
- 0035455210
- 10.1007/s11664-001-0131-y
- K. L. Lin and H. M. Hsu, J. Electron. Mater. 30, 1068 (2001). 10.1007/s11664-001-0131-y
- (2001) J. Electron. Mater. , vol.30 , pp. 1068
- Lin, K.L.¹ Hsu, H.M.²

21
- 0003459433
- (ASM, Metals Park, Ohio)
- R. Hultgren, P. D. Desai, D. T. Hawkins, M. Gleiser, and K. K. Kelley, Selected Values of the Thermodynamic Properties of Binary Alloy (ASM, Metals Park, Ohio, 1973), p. 1333.
- (1973) Selected Values of the Thermodynamic Properties of Binary Alloy , pp. 1333
- Hultgren, R.¹ Desai, P.D.² Hawkins, D.T.³ Gleiser, M.⁴ Kelley, K.K.⁵

22
- 0003459433
- (ASM, Metals Park, Ohio)
- R. Hultgren, P. D. Desai, D. Hawkins, M. Gleiser, and K. K. Kelley, Selected Values of the Thermodynamic Properties of Binary Alloy (ASM, Metals Park, Ohio, 1973), p. 814.
- (1973) Selected Values of the Thermodynamic Properties of Binary Alloy , pp. 814
- Hultgren, R.¹ Desai, P.D.² Hawkins, D.³ Gleiser, M.⁴ Kelley, K.K.⁵

23
- 0031139581
- 10.1016/S1359-6454(96)00325-4
- B. J. Lee, N. M. Hwang, and H. M. Lee, Acta Mater. 45, 1867 (1997). 10.1016/S1359-6454(96)00325-4
- (1997) Acta Mater. , vol.45 , pp. 1867
- Lee, B.J.¹ Hwang, N.M.² Lee, H.M.³

24
- 13444269367
- Formation and morphology of the intermetallic compounds formed at the 91Sn-8.55Zn-0.45Al lead-free solder alloy/Cu interface
- DOI 10.1016/j.jallcom.2004.08.009, PII S092583880401014X
- M.-C. Wang, S.-P. Yu, T.-C. Chang, and M.-H. Hon, J. Alloys Compd. 389, 133 (2005). 10.1016/j.jallcom.2004.08.009 (Pubitemid 40200720)
- (2005) Journal of Alloys and Compounds , vol.389 , Issue.1-2 , pp. 133-139
- Wang, M.-C.¹ Yu, S.-P.² Chang, T.-C.³ Hon, M.-H.⁴

25
- 0003459433
- (ASM, Metals Park, Ohio)
- R. Hultgren, P. D. Desai, D. T. Hawkins, M. Gleiser, and K. K. Kelley, Selected Values of the Thermodynamic Properties of Binary Alloy (ASM, Metals Park, Ohio, 1973), p. 118.
- (1973) Selected Values of the Thermodynamic Properties of Binary Alloy , pp. 118
- Hultgren, R.¹ Desai, P.D.² Hawkins, D.T.³ Gleiser, M.⁴ Kelley, K.K.⁵

26
- 0003459433
- (ASM, Metals Park, Ohio)
- R. Hultgren, P. D. Desai, D. T. Hawkins, M. Gleiser, and K. K. Kelley, Selected Values of the Thermodynamic Properties of Binary Alloy (ASM, Metals Park, Ohio, 1973), p. 816.
- (1973) Selected Values of the Thermodynamic Properties of Binary Alloy , pp. 816
- Hultgren, R.¹ Desai, P.D.² Hawkins, D.T.³ Gleiser, M.⁴ Kelley, K.K.⁵

27
- 29044448033
- Early dissolution behavior of copper in a molten Sn-Zn-Ag solder
- DOI 10.1557/JMR.2005.0080
- C. H. Yu and K. L. Lin, J. Mater. Res. 20, 666 (2005). 10.1557/JMR.2005.0080 (Pubitemid 41786983)
- (2005) Journal of Materials Research , vol.20 , Issue.3 , pp. 666-671
- Yu, C.-H.¹ Lin, K.-L.²

28
- 34848872225
- 5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu
- DOI 10.1063/1.2776002
- J. O. Suha, K. N. Tu, and N. Tamura, J. Appl. Phys. 102, 063511 (2007). 10.1063/1.2776002 (Pubitemid 47508924)
- (2007) Journal of Applied Physics , vol.102 , Issue.6 , pp. 063511
- Suh, J.O.¹ Tu, K.N.² Tamura, N.³

29
- 34547677920
- 5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu
- DOI 10.1063/1.2761840
- J. O. Suha, K. N. Tu, and N. Tamura, Appl. Phys. Lett. 91, 051907 (2007). 10.1063/1.2761840 (Pubitemid 47210785)
- (2007) Applied Physics Letters , vol.91 , Issue.5 , pp. 051907
- Suh, J.O.¹ Tu, K.N.² Tamura, N.³

30
- 44449105957
- 10.1016/j.scriptamat.2008.03.031
- P. J. Shang, Z. Q. Liu, D. X. Lia, and J. K. Shanga, Scripta Materialia. 59, 317 (2008). 10.1016/j.scriptamat.2008.03.031
- (2008) Scripta Materialia. , vol.59 , pp. 317
- Shang, P.J.¹ Liu, Z.Q.² Lia, D.X.³ Shanga, J.K.⁴

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.