Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates

Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2479-2488

  Alam, M E ^a   Nai, S M L ^a   Gupta, M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Aging; Intermetallic compound thickness; Sn Cu solder

Indexed keywords

AGING TIME; COPPER PARTICLES; CU ADDITION; CU SUBSTRATE; IMC LAYER; INTERMETALLIC COMPOUND THICKNESS; INTERMETALLIC COMPOUNDS; INTERMETALLIC LAYER; ISOTHERMAL AGING; LAYER FORMATION; MICROWAVE-ASSISTED; NANO COPPER; NANO-SIZED; PURE TIN; REFLOW PROCESS; SN-CU SOLDERS; WEIGHT PERCENTAGES;

COPPER; METALLURGY; SEMICONDUCTING INTERMETALLICS; SINTERING; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 72549094485     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0925-x     Document Type: Article

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