Effect of composition and cooling rate on the microstructure of SnAgCu-solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1579-1588

  Mueller, M ^a   Wiese, S ^a   Roellig, M ^a   Wolter, K J ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLICS; JOINTS (STRUCTURAL COMPONENTS); OPTICAL MICROSCOPY; SOLDERING ALLOYS; SOLIDIFICATION;

BALL DIAMETER; COOLING RATE; PRIMARY INTERMETALLICS;

MICROSTRUCTURE;

EID: 35348925915     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374006     Document Type: Conference Paper

References (14)

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