Phase distribution and phase analysis in Cu6Sn5, Ni3Sn4, and the Sn-rich corner in the ternary Sn-Cu-Ni isotherm at 240°C

Journal of Electronic Materials

Volumn 35, Issue 2, 2006, Pages 343-352

  Li, Chia Ying ^a   Chiou, Guo Jyun ^a   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Intermetallic compound; Phase analysis; Phase equilibria; Sn Cu Ni; Ternary isotherm; X ray color mapping

Indexed keywords

PHASE ANALYSIS; TERNARY ISOTHERM; X-RAY COLOR MAPPING;

ELECTRONICS PACKAGING; INTERMETALLICS; ISOTHERMS; MICROELECTRONICS; PHASE EQUILIBRIA; TERNARY SYSTEMS;

TIN ALLOYS;

EID: 33644907173     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692455     Document Type: Conference Paper

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