Reflow characteristics of Sn-Ag matrix in-situ composite solders

Scripta Materialia

Volumn 42, Issue 8, 2000, Pages 827-831

  Lee, Jong Hyun ^a   Park, Dea Jin ^a   Heo, Jung Na ^a   Lee, Yong Ho ^a   Shin, Dong Hyuk ^a   Kim, Yong Seog ^a  

^a

^b South Korea

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER POWDER; INTERFACES (MATERIALS); MICROSTRUCTURE; POWDER METALS; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; X RAY DIFFRACTION ANALYSIS;

REFLOW SOLDERING;

TIN ALLOYS;

EID: 0342906506     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(99)00392-9     Document Type: Article

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