Study of the effects of Zn content on the interfacial reactions between Sn-Zn solders and Ni substrates at 250°C

Journal of Electronic Materials

Volumn 39, Issue 11, 2010, Pages 2375-2381

  Wang, Chao Hong ^a   Chen, Hsien Hsin ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Interfacial reaction; Lead free solders; Ni; Sn Zn

Indexed keywords

INTERFACIAL REACTIONS; INTERFACIAL STABILITIES; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDERS; MOLTEN SOLDERS; NI; NI SUBSTRATES; REACTION LAYERS; SN-ZN; SN-ZN SOLDER; ZN CONTENT;

INTERMETALLICS; SOLDERING ALLOYS; ZINC;

TIN;

EID: 78149285664     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1358-2     Document Type: Article

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