Porous dielectrics in microelectronic wiring applications

Materials

Volumn 3, Issue 1, 2010, Pages 536-562

  McGahay, Vincent ^a  

^a IBM   (United States)

Author keywords

Dielectric; Integrated circuit; Interconnect; Microelectronic; Porosity; Semiconductor

Indexed keywords

CARBON-DOPED OXIDES; INTERCONNECT; LOW DIELECTRIC; MICRO-ELECTRONIC DEVICES; MITIGATION STRATEGY; POROUS DIELECTRICS; SEMICONDUCTOR PROCESSING; TECHNOLOGICAL CHALLENGES;

AMORPHOUS CARBON; DIELECTRIC FILMS; DIELECTRIC MATERIALS; FILM PREPARATION; INTEGRATED CIRCUITS; PERMITTIVITY; POROSITY; SEMICONDUCTOR MATERIALS;

MICROELECTRONICS;

EID: 84859308018     PISSN: None     EISSN: 19961944     Source Type: Journal    
DOI: 10.3390/ma3010536     Document Type: Article

References (130)

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