Carbon-rich SiOCH films with hydrocarbon network bonds for low-k dielectrics: first-principles investigation

2006 International Interconnect Technology Conference, IITC

Volumn , Issue , 2006, Pages 122-124

  Tajima, N ^a   Ohno, T ^a   Hamada, T ^b   Yoneda, K ^c   Kotayashi, N ^c   Shinriki, M ^d   Miyazawa, K ^d   Sakota, K ^d   Hasaka, S ^d   Inoue, M ^d  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

^c SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC   (Japan)

^d TAIYO NIPPON SANSO CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON FILMS; CHEMICAL PROPERTIES; DIELECTRIC MATERIALS; DIELECTRIC PROPERTIES; ELECTRIC CURRENTS; HYDROCARBONS; MECHANICAL PROPERTIES; ORGANIC COMPOUNDS; POLYMER FILMS; TECHNOLOGY;

90 NM TECHNOLOGY NODE; CARBON-RICH; CHEMICAL STRUCTURES; FILM STRUCTURES; FIRST-PRINCIPLES; HYDROCARBON COMPONENTS; INTERCONNECT TECHNOLOGIES; INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE; K-VALUES; LOW- K FILMS; LOW-K DIELECTRICS; MECHANICAL STRENGTHS; POLYMER NETWORKS;

PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

EID: 50249188387     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2006.1648664     Document Type: Conference Paper

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