Moisture-driven crack growth in blanket low dielectric constant and ultralow dielectric constant films

Journal of Applied Physics

Volumn 96, Issue 6, 2004, Pages 3482-3485

  Liniger, E G ^a   Simonyi, E E ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK DRIVING FORCE; FRACTURE RESISTANCE; THERMAL COEFFICIENT OF EXPANSION (TCE); ULTRALOW DIELECTRIC CONSTANT (ULK) FILMS;

CHEMICAL BONDS; CHEMICAL VAPOR DEPOSITION; CRACK INITIATION; CRACK PROPAGATION; ELASTIC MODULI; FRACTURE; INTERFACIAL ENERGY; PERMITTIVITY; POROSITY; STRESS CORROSION CRACKING; SURFACE PROPERTIES; THERMAL EXPANSION; THICKNESS MEASUREMENT;

DIELECTRIC FILMS;

EID: 4944260920     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1774269     Document Type: Article

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