Plasma sealing of a low-K dielectric polymer

Microelectronic Engineering

Volumn 76, Issue 1-4, 2004, Pages 32-37

  Hoyas, A Martin ^a,b   Schuhmacher, J ^a   Whelan, C M ^a   Celis, J P ^c   Maex, K ^a,b  

^a IMEC   (Belgium)

^b Katholieke Universiteit Leuven   (Belgium)

^c UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

DENSIFICATION; DEPOSITION; ELLIPSOMETRY; LEAKAGE CURRENTS; PLASMAS; POLYMERS; REACTIVE ION ETCHING; SEALING (CLOSING); SILICA; X RAY PHOTOELECTRON SPECTROSCOPY;

ATOMIC LAYER DEPOSITION (ALD); LOW K DIELECTRICS; PLASMA SEALING; POLARIZABILITY;

DIELECTRIC MATERIALS;

EID: 4544318627     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.07.024     Document Type: Conference Paper

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