Laser spike annealing: A novel post-porosity treatment for significant toughening of low-k organosilicates

2006 International Interconnect Technology Conference, IITC

Volumn , Issue , 2006, Pages 146-148

  Volksen, Willi ^a   Dubois, Geraud ^a   Kellock, Andrew ^a   Magbitang, Teddie P ^a   Miller, Robert D ^a   Cohen, Stephan ^b   Simonyi, Eva E ^b   Ramirez, Lynher ^c   Wang, Yun ^d  

^a IBM ALMADEN RESEARCH CENTER   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

^d Ultratech Stepper Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON CONTENTS; CHEMICAL COMPOSITIONS; CHEMICAL-; CONCOMITANT DECREASE; DIELECTRIC CONSTANTS; DWELL TIMES; HIGH TEMPERATURES; INFRA-RED; INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE; LASER THERMAL; METHYL GROUPS; METHYL SILSESQUIOXANE; ORGANOSILICATES; RBS ANALYSIS; RUTHERFORD BACK-SCATTERING; SHORT PERIODS; SPIKE ANNEALING;

ABSORPTION; ANNEALING; DIELECTRIC MATERIALS; HEAT TREATMENT; HYDROCARBONS; LASERS; MECHANICAL PROPERTIES; NONMETALS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SILICON; TECHNOLOGY;

CHEMICAL ANALYSIS;

EID: 50249102832     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2006.1648672     Document Type: Conference Paper

References (9)

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