Influence of NH3 plasma treatment on chemical bonding and water adsorption of low-k SiCOH film

Microelectronic Engineering

Volumn 85, Issue 10, 2008, Pages 2114-2117

  Guo, Hao Wen ^a   Zhu, Lian ^a   Zhang, Lei ^a   Ding, Shi Jin ^a   Zhang, David Wei ^a   Liu, Ran ^a  

^a FUDAN UNIVERSITY   (China)

Author keywords

Chemical bonding; Low k SiCOH film; NH3 plasma treatment; Water adsorption

Indexed keywords

ADSORPTION; CHEMICAL VAPOR DEPOSITION; DEWATERING; DIELECTRIC MATERIALS; NONMETALS; SILICA; SILICON COMPOUNDS; WATER VAPOR;

CHEMICAL BONDING; CHEMICAL VAPORS; DOPED SILICON; INTERLAYER MATERIALS; LOW-K SICOH FILM; NH3 PLASMA TREATMENT; SICOH FILMS; WATER ADSORPTION;

GAS ADSORPTION;

EID: 52149094560     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.05.032     Document Type: Article

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