Characterization of plasma damaged porous ULK SiCOH layers in aspect of changes in the diffusion behavior of solvents and repair-chemicals

Proceedings of the 2009 IEEE International Interconnect Technology Conference, IITC 2009

Volumn , Issue , 2009, Pages 83-85

  Oszinda, Thomas ^a   Schaller, Matthias ^b   Fischer, Daniel ^b   Schulz, Stefan E ^c  

^a Fraunhofer Center Nanoelectronic Technologies   (Germany)

^b IBM MICROELECTRONICS   (United States)

^c FRAUNHOFER INSTITUTE FOR ELECTRONIC NANO SYSTEMS ENAS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION EFFECT; DIELECTRIC LAYER; DIFFERENT SOLVENTS; DIFFUSION BEHAVIOR; DIFFUSION COEFFICIENTS; LINEAR DEPENDENCY; POROUS ULK; REPAIR PROCESS; SURFACE ENERGIES;

ADSORPTION; DIELECTRIC MATERIALS; DIFFUSION; INTERFACIAL ENERGY; MOLECULES; PORE SIZE; REPAIR; SURFACE CHEMISTRY; SURFACE CLEANING; SURFACE TENSION;

SURFACE DIFFUSION;

EID: 70349445570     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2009.5090346     Document Type: Conference Paper

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