Overview of dual damascene integration schemes in Cu BEOL integration

Microelectronic Engineering

Volumn 85, Issue 10, 2008, Pages 2128-2132

  Kriz, J ^a   Angelkort, C ^a   Czekalla, M ^a   Huth, S ^a   Meinhold, D ^a   Pohl, A ^a   Schulte, S ^a   Thamm, A ^a   Wallace, S ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Dual damascene; Hardmask; Trench first; Via first

Indexed keywords

ASPECT RATIO; COPPER; PRESSURE DROP;

BEOL INTEGRATION; DUAL DAMASCENE; DUAL DAMASCENE INTEGRATION; HARD MASKS; HARDMASK; TRENCH FIRST; VIA FIRST;

METALS;

EID: 52149103569     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.05.034     Document Type: Article

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