Channel cracking in low-k films on patterned multi-layers

Proceedings of the IEEE 2004 International Interconnect Technology Conference

Volumn , Issue , 2004, Pages 93-95

  Liu, X H ^a   Shaw, T M ^a   Lane, M W ^a   Rosenberg, R R ^a   Lane, S L ^a   Doyle, J P ^a   Restaino, D ^a   Vogt, S F ^a   Edelstein, D C ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL COST; ENERGY RELEASE RATE (ERR); FILM CRACKING; THERMAL MISMATCH;

CHEMICAL VAPOR DEPOSITION; CRACKING (CHEMICAL); DELAMINATION; DIELECTRIC MATERIALS; ELASTIC MODULI; ELECTRIC CONDUCTIVITY; FINITE ELEMENT METHOD; MULTILAYERS; PERMITTIVITY; STRAIN; TENSILE TESTING;

THIN FILMS;

EID: 4544252650     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. J. W. Hutchinson, Z. Suo, "Mixed mode cracking in layered materials", Advances in Applied Mechanics, Vol. 29, 1992, pp. 63-191.
2. X. H. Liu, Z. Suo, Q. Ma, H. Fujimoto, "Developing design rules to avert cracking and debonding circuit structures", Engineering Fracture Mechanics, Vol. 66, 2000, pp. 387-402.
3. Z. Suo, "Reliability of interconnect structures", Vol. 8, Interfacial and Nanoscale Failure, W. Gerberich, W. Yang, Editors, Comprehensive Structural Integrity, I. Milne, R. O. Ritchie, B. Karihaloo, Editors-in-Chief, Elsevier, 2003, pp. 265-324.
4. J. M. Ambrico, E. E. Jones, M. R. Begley, "Cracking in thin multi-layers with finite-width and periodic architectures", International Journal of Solids and Structures Vol. 39, 2002, pp. 14431462.
5. D. C. Edelstein et al, "Comprehensive Reliability Evaluation of a 90 nm CMOS Technology with Cu/PECVD Low-K BEOL", International Reliability Physics Symposium, Phoenix, AZ, 2004, in press.