Mechanistic study of plasma damage and CH4 recovery of low k dielectric surface

Proceedings of the IEEE 2007 International Interconnect Technology Conference - Digest of Technical Papers

Volumn , Issue , 2007, Pages 147-149

  Bao, J J ^a   Shi, H L ^a   Liu, J J ^a   Huang, H ^a   Ho, P S ^a   Goodner, M D ^b   Moinpour, M ^b   Kloster, G M ^b  

^a The University of Texas at Austin   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC PHYSICS; DIELECTRIC MATERIALS; OXIDE FILMS; PERMITTIVITY; PLASMA APPLICATIONS; POLYMER FILMS; REACTIVE ION ETCHING;

ATOMIC RADICALS; CARBON-RICH POLYMER LAYERS; MECHANISTIC STUDY; PLASMA DAMAGE; PLASMA TREATMENT;

SURFACE DEFECTS;

EID: 34748812681     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iitc.2007.382366     Document Type: Conference Paper

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