Nanoimprint lithography: 2D or not 2D? A review

Applied Physics A: Materials Science and Processing

Volumn 121, Issue 2, 2015, Pages 415-435

  Schift, Helmut ^a  

^a PAUL SCHERRER INSTITUTE   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

LITHOGRAPHY; MOLDS; POLYMER FILMS; SEMICONDUCTING FILMS;

3-D DISPLACEMENT; 3D APPLICATION; MASKING LAYERS; MOLD CAVITIES; MORE THAN MOORE; NANO-METER SCALE; REPLICATION TECHNIQUES; THERMALLY ACTIVATED;

NANOIMPRINT LITHOGRAPHY;

EID: 84925989574     PISSN: 09478396     EISSN: 14320630     Source Type: Journal    
DOI: 10.1007/s00339-015-9106-3     Document Type: Article

References (166)

1. R.C. Jaeger, C. Richard, Lithography. Introduction to Microelectronic Fabrication, 2nd edn. (Prentice Hall, Upper Saddle River, 2002), p. 315. ISBN 0-201-44494-1
2. M. Madou, Manufacturing Techniques for Microfabrication and Nanotechnology, 3rd edn. (CRC Press, Taylor & Francis, Boca Rayton, FL). ISBN 978-1-4200-5519-1
3. E.W. Becker, W. Ehrfeld, P. Hagmann, A. Maner, D. Münchmeyer, Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process). Microelectron. Eng. 4(1), 35–56 (1986)
4. W. Menz, J. Mohr, O. Paul, Microsystem Technology, 2nd edn. (Wiley-VCH, Weinheim, 2008). ISBN: 978-3-527-61301-4
5. M. Messerschmidt, A. Schleunitz, C. Spreu, T. Werner, M. Vogler, F. Reuther, A. Bertz, H. Schift, G. Grützner, Thermal nanoimprint resist for the fabrication of high-aspect-ratio patterns. Microelectron. Eng. 98(8), 107–111 (2012)
6. S. Gorelick, V.A. Guzenko, J. Vila-Comamala, C. David, Direct e-beam writing of dense and high aspect ratio nanostructures in thick layers of PMMA for electroplating. Nanotechnology 21, 295303 (2010)
7. A. Schleunitz, H. Schift, Fabrication of 3-D patterns with vertical and sloped sidewalls by grayscale electron-beam lithography and thermal annealing. Microelectron. Eng. 88(8), 2736–2739 (2011)
8. J.K. Gansel, M. Latzel, A. Frölich, J. Kaschke, M. Thiel, M. Wegener, Tapered gold-helix metamaterials as improved circular polarizers. Appl. Phys. Lett. 100, 101109 (2012)
9. S. Fujimori, Fine pattern fabrication by the molded mask method (nanoimprint lithography) in the 1970s. Jpn. J. Appl. Phys. 48, 06FH01 (2009)
10. S.Y. Chou, P.R. Krauss, P.J. Renstrom, Imprint of sub-25 nm vias and trenches in polymers. Appl. Phys. Lett. 67(21), 3114–3116 (1995)
11. J. Haisma, M. Verheijen, K. van den Heuvel, J. van den Berg, Mold-assisted lithography: a process for reliable pattern transfer. J. Vac. Sci. Technol. B 14, 4124–4128 (1996)
12. R.W. Jaszewski, H. Schift, J. Gobrecht, P. Smith, Hot embossing in polymers as a direct way to pattern resist. Microelectron. Eng. 41(42), 575–578 (1998)
13. M. Colburn, S. Johnson, M. Stewart, S. Damle, T. Bailey, B. Choi, M. Wedlake, T. Michaelson, S.V. Sreenivasan, J.G. Ekerdt, C.G. Willson, Step and flash imprint lithography: a new approach to high resolution patterning, in Proceedings of the SPIE 3676, (1999), pp. 379–385
14. B. Heidari, Nanoimprint lithography at the 6 in. wafer scale. J. Vac. Sci. Technol. B 18, 3557–3560 (2000)
15. W. Zhou, Nanoimprint Lithography: An enabling process for nanofabrication (Springer-Verlag Berlin Heidelberg, 2013), pp. 256. ISBN: 978-3-642-34427-5
16. M. Beck, M. Graczyk, I. Maximov, E.-L. Sarwe, T.G.I. Ling, M. Keil, L. Montelius, Improving stamps for 10 nm level wafer scale nanoimprint lithography. Microelectron. Eng. 61–62, 441–448 (2002)
17. Y. Hirai, Y. Tanaka, Application of nano-imprint lithography. J. Photopolym. Sci. Technol. 15, 475–480 (2002)
18. D.J. Resnick, S.V. Sreenivasan, C.G. Willson, Step & flash imprint lithography. Mater. Today 8(2), 34–42 (2005)
19. L.J. Guo, Recent progress in nanoimprint technology and its applications. J. Phys. D Appl. Phys. 37, R123–R141 (2004)
20. L.J. Guo, Nanoimprint lithography: methods and material requirement. Adv. Mater. 19, 495–513 (2007)
21. L.J. Heyderman, H. Schift, C. David, J. Gobrecht, T. Schweizer, Flow behaviour of thin polymer films used for hot embossing lithography. Microelectron. Eng. 54, 229–245 (2000)
22. H.-C. Scheer, H. Schulz, A contribution to the flow behaviour of thin polymer films during hot embossing lithography. Microelectron. Eng. 56(3–4), 311–332 (2001)
23. H. Schift, L.J. Heyderman, Chapter (4), in Alternative Lithography—Unleashing the Potential of Nanotechnology. Book Series on Nanostructure Science and Technology, ed. by C. Sotomayor Torres, D.J. Lockwood (Kluwer Academic/Plenum Publishers, 2003), p. 46. ISBN 0-306-47858-7
24. H. Tan, A. Gilbertson, S.Y. Chou, Roller nanoimprint lithography. J. Vac. Sci. Technol. B 16, 3926–3928 (1998)
25. H. Schift, Roll embossing and roller imprint, Chapter in Science and new technology in nanoimprint, in Advanced Technology and Application of Nanoimprint, ed. by Y. Hirai. Frontier Publishing Co., Ltd., Japan, ISBN 4-902410-09-5, June 2006, pp. 74–89, and Japanese translation (extract) 90–93 (2006)
26. H. Schift, M. Halbeisen, U. Schütz, B. Delahoche, J. Gobrecht, Surface structuring of textile fibers using roll embossing. Microelectron. Eng. 83, 855–858 (2006)
27. S.H. Ahn, L.J. Guo, Large-area roll-to-roll and roll-to-plate nanoimprint lithography: a step toward high-throughput application of continuous nanoimprinting. ACS Nano 3(8), 2304–2310 (2009)
28. T. Mäkelä, T. Haatainen, J. Ahopelto, Roll-to-roll printed gratings in cellulose acetate web using novel nanoimprinting device. Microelectron. Eng. 88, 2045–2047 (2011)
29. N. Kooy, K. Mohamed, L.T. Pin, O.S. Guan, A review of roll-to-roll nanoimprint lithography. Nanoscale Res. Lett. 9, 320 (2014)
30. H. Schift, Nanoimprint lithography: an old story in modern times? A review. J. Vac. Sci. Technol. B 26(2), 458–480 (2008)
31. A. Schleunitz, C. Spreu, T. Mäkelä, T. Haatainen, A. Klukowska, H. Schift, Hybrid working stamps for high speed roll-to-roll nanoreplication with molded sol–gel relief on a metal backbone. Microelectron. Eng. 88(8), 2113–2116 (2011)
32. S. Merino, A. Retolaza, H. Schift, V. Trabadelo, Stamp deformation and its influence on residual layer homogeneity in thermal nanoimprint lithography. Microelectron. Eng. 85, 877–880 (2008)
33. H. Schift, S. Bellini, J. Gobrecht, Perforated polymer membranes fabricated by nanoimprint lithography. Microelectron. Eng. 83, 873–875 (2006)
34. H. Schift, A. Kristensen, Nanoimprint lithography—patterning resists using molding, in Chapter (Part A/9) in Handbook of Nanotechnology, 3rd edn. ed. by B. Bhushan, (Springer, Berlin, 2010), pp. 271–312. ISBN: 978-3-642-02524-2, XLVIII, with DVD
35. H. Schift, Nanoimprint lithography and micro-embossing in LiGA technology: similarities and differences. J. Microsyst. Technol. (2013). doi:10.1007/s00542-013-1915-8
36. H. Schift, P. Urwyler, P.M. Kristiansen, J. Gobrecht, Nanoimprint lithography process chains for the fabrication of micro- and nanodevices. J. Micro/Nanolithogr. MEMS MOEMS 13(3), 031303 (2014)
37. X. Cheng, Building 3D micro- and nano-structures through nanoimprint, Chapter 3, 59–85, in Three-Dimensional Nanoarchitectures: Designing Next-Generation Devices, ed. by W. Zhou, Z.L. Wang (Springer Science & Business Media, New York, 2011), 556 p
38. M.T. Gale, Replication techniques for diffractive optical elements. Microelectron. Eng. 34, 321–339 (1997)
39. NaPa library of processes—nanopatterning and applications, ed. H. Schift, published by the NaPa-consortium, 3rd edn. (2014). (12 Dec 2014). http://www.psi.ch/lmn/helmut-schift
40. H. Schift, C. David, M. Gabriel, J. Gobrecht, L.J. Heyderman, W. Kaiser, S. Köppel, L. Scandella, Nanoreplication in polymers using hot embossing and injection molding. Microelectron. Eng. 53, 171–174 (2000)
41. Y. Xia, G.M. Whitesides, Soft lithography. Angew. Chem. Int. Ed. 37(5), 550–575 (1998)
42. B. Michel, A. Bernard, A. Bietsch, E. Delamarche, M. Geissler, D. Juncker, H. Kind, J.-P. Renault, H. Rothuizen, H. Schmid, P. Schmidt-Winkel, R. Stutz, H. Wolf, Printing meets lithography: soft approaches to high-resolution patterning. IBM J. Res. Dev. 45(5), 697–719 (2001)
43. L.J. Heyderman, H. Schift, C. David, B. Ketterer, M. Auf der Maur, J. Gobrecht, Nanofabrication using hot embossing lithography and electroforming. Microelectron. Eng. 57–58, 375–380 (2001)
44. L.J. Heyderman, B. Ketterer, D. Bächle, F. Glaus, B. Haas, H. Schift, K. Vogelsang, J. Gobrecht, L. Tiefenauer, O. Dubochet, P. Surbled, T. Hessler, High volume fabrication of customised nanopore membrane chips. Microelectronic Eng. 67–68, 208–213 (2003)
45. J.M. Stauffer, Y. Oppliger, P. Regnault, L. Baraldi, M.T. Gale, Electron beam writing of continuous resist profiles for optical applications. J. Vac. Soc. Technol. B 10, 2526–2529 (1992)
46. M.T. Gale, M. Rossi, H. Schuetz, Fabrication of continuous-relief micro-optical elements by direct laser writing in photoresist, laser-assisted fabrication of thin films and microstructures, in Proceedings of the SPIE 2045, (1994), pp. 54–62
47. E.A. Dobisz, S.L. Brandow, R. Bass, J. Mitterender, Effects of molecular properties on nanolithography in polymethyl methacrylate. J. Vac. Sci. Technol. B 18, 107–111 (2000)
48. G. Piaszenski, U. Barth, A. Rudzinski, A. Rampe, A. Fuchs, M. Bender, U. Plachetka, 3D structures for UV-NIL template fabrication with greyscale e-beam lithography. Microelectron. Eng. 84, 945–948 (2007)
49. GenISys beamer electron-beam lithography software, http://genisys-gmbh.com/web/products/beamer.html
50. H.-B. Sun, S. Kawata, Two-photon photopolymerization and 3D lithographic microfabrication, in NMR - 3D Analysis - Photopolymerization. Advances in Polymer Science, vol 170 (Springer Berlin Heidelberg, 2004), pp. 169–273. ISBN: 978-3-540-20510-4 (Print) 978-3-540-40000-4 (Online)
51. F. Holzner, P. Paul, M. Despont. L.L. Cheong, J. Hedrick, U. Dürig, A. Knoll, Thermal probe nanolithography: in situ inspection, high-speed, high-resolution, 3D, in Proceedings of the SPIE 8886, (2013), p. 888605
52. D. Pires, J.L. Hedrick, A. De Silva, J. Frommer, B. Gotsmann, H. Wolf, M. Despont, U. Duerig, A.W. Knoll, Nanoscale three-dimensional patterning of molecular resists by scanning probes. Science 328, 732–735 (2010)
53. R. Garcia, A.W. Knoll, E. Riedo, Advanced scanning probe lithography. Nat. Nanotechnol. 9(8), 577–587 (2014)
54. C. David, Fabrication of stair-case profiles with high aspect ratios for blazed diffractive optical elements. Microelectron. Eng. 53, 677–680 (2000)
55. S. Landis, V. Reboud, T. Enot, C. Vizioz, Three dimensional on 300 mm wafer scale nano imprint lithography processes. Microelectron. Eng. 110, 198–203 (2013)
56. R. Huber, J. Conrad, L. Schmitt, K. Hecker, J. Scheurer, M. Weber, Fabrication of multilevel silicon structures by anisotropic deep silicon etching. Microelectron. Eng. 67–68, 410–416 (2003)
57. C.D. Popovic, R.A. Sprague, G.A. Neville, Connell, Techniques for monolithic fabrication of microlens arrays. Appl. Opt. 27, 1281–1284 (1988)
58. D. Daly, R.F. Stevens, M.C. Hutley, N. Davies, The manufacture of microlenses by melting photoresist. Meas. Sci. Technol. 1, 759–766 (1990)
59. H. Mekaru, Influence of residual layer on cross-sectional shape of thermal-reflowed photoresist structures. Microsyst. Technol. (2014). doi:10.1007/s00542-014-2389-z
60. A. Schleunitz, H. Schift, Fabrication of 3-D nanoimprint stamps with continuous reliefs using dose-modulated electron beam lithography and thermal reflow. J. Micromech. Microeng. 20, 095002 (2010)
61. A. Schleunitz, V.A. Guzenko, M. Messerschmidt, H. Atasoy, R. Kirchner, H. Schift, Novel 3D micro- and nanofabrication method using thermally activated selective topography equilibration (TASTE) of polymers. Nano Converg. 1, 7 (2014)
62. A. Schleunitz, C. Spreu, M. Vogler, H. Atasoy, H. Schift, Combining nanoimprint lithography and a molecular weight selective thermal reflow for the generation of mixed 3-D structures. J. Vac. Sci. Technol. B 29(6), 06FC01 (2011)
63. R. Kirchner, H. Schift, Mobility based 3D simulation of selective, viscoelastic polymer reflow using surface evolver. J. Vac. Sci. Technol. B 32, 06F701 (2014)
64. R. Kirchner, A. Schleunitz, H. Schift, Energy-based thermal reflow simulation for 3D polymer shape prediction using the surface evolver. J. Micromech. Microeng. 24(5), 055010 (2014)
65. M. Tormen, A. Carpentiero, E. Ferrari, D. Cojoc, E. Di Fabrizio, Novel fabrication method for three-dimensional nanostructuring: an application to micro-optics. Nanotechnology 18, 385301 (2007)
66. H. Schift, C. Spreu, A. Schleunitz, J.J. Lee, Shape control of polymer reflow structures fabricated by nanoimprint lithography. Microelectron. Eng. 88, 87–92 (2011)
67. M.T. Gale, L.G. Baraldi, R.E. Kunz, Replicated microstructures for integrated optics, in Proceedings of the SPIE 2213, (1994), pp. 2–10
68. L.G. Baraldi, Heissprägen in Polymeren für die Herstellung integriert-optischer Systemkomponenten, PhD thesis, Diss. ETH. Nr. 10762 (1994)
69. Y. Hirai, Y. Onishi, T. Tanabe, M. Shibata, T. Iwasaki, Y. Iriye, Pressure and resist thickness dependency of resist time evolutions profiles in nanoimprint lithography. Microelectron. Eng. 85, 842–845 (2008)
70. H.D. Rowland, A.C. Sun, P.R. Schunk, W.P. King, Impact of polymer film thickness and cavity size on polymer flow during embossing: toward process design rules for nanoimprint lithography. J. Micromech. Microeng. 15, 2414–2425 (2005)
71. T. Leveder, S. Landis, L. Davoust, N. Chaix, Flow property measurements for nanoimprint simulation. Microelectron. Eng. 84, 928–931 (2007)
72. T. Leveder, S. Landis, L. Davoust, N. Chaix, Optimization of demolding temperature for throughput improvement of nanoimprint lithography. Microelectron. Eng. 84, 953–957 (2007)
73. H. Teyssèdre, P. Gilormini, Extension of the natural element method to surface tension and wettability for the simulation of polymer flows at the micro and nano scales. J. Non-Newton. Fluid Mech. 200, 9–16 (2013)
74. N. Koo, U. Plachetka, M. Otto, J. Bolten, J.-H. Jeong, E.-S. Lee, H. Kurz, The fabrication of a flexible mold for high resolution soft ultraviolet nanoimprint lithography. Nanotechnology 19, 225304 (2008)
75. N. Koo, M. Otto, J.W. Kim, J.-H. Jeong, H. Kurz, Press and release imprint: control of the flexible mold deformation and the local variation of residual layer thickness in soft UV-NIL. Microelectron. Eng. 88(6), 1033–1036 (2011)
76. H. Schift, S. Bellini, J. Gobrecht, F. Reuther, M. Kubenz, M.B. Mikkelsen, K. Vogelsang, Fast heating and cooling in nanoimprint using a spring-loaded adapter in a preheated press. Microelectron. Eng. 84, 932–936 (2007)
77. H. Schift, G. Kim, J.J. Lee, J. Gobrecht, 3D visualization of mold filling stages in thermal nanoimprint by white light interferometry and atomic force microscopy. Nanotechnology 20, 355301 (2009)
78. H. Schift, A. D’Amore, C. David, M. Gabriel, J. Gobrecht, W. Kaiser, D. Simoneta, Quantitative analysis of the molding of nanostructures. J. Vac. Sci. Technol. B 18(6), 3564–3568 (2000)
79. H. Schift, M. Altana, A. Schleunitz, Sidewall-angle dependent mold filling of three-dimensional microcavities in thermal nanoimprint lithography. J. Vac. Sci. Technol. B 30(6), 06FB09 (2012)
80. H. Schift, S. Park, J. Gobrecht, Nano-imprint—molding resists for lithography. J. Photopolym. Sci. Technol. (Jpn.) 16(3), 435–438 (2003)
81. V. Sirotkin, A. Svintsov, H. Schift, S. Zaitsev, Coarse-grain method for modeling of stamp and substrate deformation in nanoimprint. Microelectron. Eng. 84, 868–871 (2007)
82. M. Heckele, W.K. Schomburg, Review on micro molding of thermoplastic polymers. J. Micromech. Microeng. 14, R1 (2004)
83. M. Worgull, Hot Embossing, 1st edn. (William Andrew, Oxford, 2009)
84. S. Klammt, H. Müller, A. Neyer, Redirection of sunlight by microstructured components—simulation, fabrication and experimental results. Sol. Energy 86, 1660–1666 (2012)
85. H. Schift, L.J. Heyderman, M. Auf der Maur, J. Gobrecht, Pattern formation in hot embossing of thin polymer films. Nanotechnology 12, 173–177 (2001)
86. N. Chaix, C. Gourgon, S. Landis, C. Perret, M. Fink, F. Reuther, D. Mecerreyes, Influence of the molecular weight and imprint conditions on the formation of capillary bridges in nanoimprint lithography. Nanotechnology 17, 4082–4087 (2006)
87. H.-C. Scheer, A. Mayer, K. Dhima, S. Wang, C. Steinberg, Challenges with high aspect ratio nanoimprint. Microsyst. Technol. 20(10–11), 1891–1898 (2014)
88. Y. Hirai, UV-nanoimprint lithography (NIL) process simulation. Photopolym. Sci. Technol. (Jpn.) 23, 25–32 (2010)
89. H. Schulz, M. Wissen, H.-C. Scheer, Local mass transport and its effect on global pattern replication during hot embossing. Microelectron. Eng. 67–68, 657–663 (2003)
90. R.W. Jaszewski, H. Schift, B. Schnyder, A. Schneuwly, P. Gröning, The deposition on anti-adhesive ultra-thin teflon-like films and their interaction with polymers during hot embossing. Appl. Surf. Sci. 143, 301–308 (1999)
91. S. Park, H. Schift, C. Padeste, J. Gobrecht, Nanostructuring of anti-adhesive layer by hot embossing lithography. Microelectron. Eng. 61–62, 423–428 (2003)
92. H. Schift, S. Saxer, S. Park, C. Padeste, U. Pieles, J. Gobrecht, Controlled co-evaporation of silanes for nanoimprint stamps. Nanotechnology 16, S171–S175 (2005)
93. V. Trabadelo, H. Schift, S. Merino, S. Bellini, J. Gobrecht, Measurement of demolding forces in full wafer thermal nanoimprint. Microelectron. Eng. 85, 907–909 (2008)
94. S. Merino, H. Schift, A. Retolaza, T. Haatainen, The use of automatic demolding in nanoimprint lithography processes. Microelectron. Eng. 84, 958–962 (2007). doi:10.1016/j.mee.2007.01.023
95. Y. Guo, G. Liu, Y. Xiong, Y. Tian, Study of the demolding process—implications for thermal stress, adhesion and friction control. J. Micromech. Microeng. 17, 9–19 (2007)
96. H. Takagi, M. Takahashi, R. Maeda, Y. Onishi, Y. Iriye, T. Iwasaki, Y. Hirai, Experimental and numerical analyses on recovery of polymer deformation after demolding in the hot embossing process. J. Vac. Sci. Technol. B 26, 2399–2404 (2008)
97. S. Park, Z. Song, L. Brumfield, A. Amirsadeghi, J. Lee, Demolding temperature in thermal nanoimprint lithography. Appl. Phys. A 97(2), 395–402 (2009)
98. H. Kawata, K. Kubo, Y. Watanabe, J. Sakamoto, M. Yasuda, Y. Hirai, Effects of mold side wall profile on demolding characteristics. Jpn. J. Appl. Phys. 49(6S), 06GL15 (2010)
99. M.E. Dirckx, D.E. Hardt, Analysis and characterization of demolding of hot embossed polymer microstructures. J. Micromech. Microeng. 21, 085024 (2011)
100. K. Kuwabara, A. Miyauchi, High-aspect-ratio nanopillar structures fabricated by nanoimprinting with elongation phenomenon. J. Vac. Sci. Technol. B 26, 582–584 (2008)
101. S. Möllenbeck, N. Bogdanski, M. Wissen, H.-C. Scheer, J. Zajadacz, K. Zimmer, Investigation of the separation of 3D-structures with undercuts. Microelectron. Eng. 84, 1007–1010 (2007)
102. S. Möllenbeck, N. Bogdanski, A. Mayer, H.-C. Scheer, J. Zajadacz, K. Zimmer, Moulding of arrowhead structures. Microelectron. Eng. 86, 608–610 (2009)
103. G. Shao, J. Wu, Z. Cai, W. Wang, Fabrication of elastomeric high-aspect-ratio microstructures using polydimethylsiloxane (PDMS) double casting technique. Sens. Actuators A 178, 230–236 (2012)
104. P.K. Sahoo, K. Vogelsang, H. Schift, H.H. Solak, Surface plasmon resonance in near field coupled gold cylinder array fabricated by EUV-interference lithography and hot embossing. Appl. Surf. Sci. 256(2), 431–434 (2009)
105. A. Finn, B. Lu, R. Kirchner, X. Thrun, K. Richter, W.-J. Fischer, High aspect ratio pattern collapse of polymeric UV-nano-imprint molds due to cleaning. Microelectron. Eng. 110, 112–118 (2013)
106. M. Miller, G. Doyle, N. Stacey, F. Xu, S.V. Sreenivasan, M. Watts, D.L. LaBrake, Fabrication of nanometer sized features on non-flat substrates using a nano-imprint lithography process, in Proceedings of the SPIE 5751, (2005), pp. 994–1002
107. D.J. Resnick, G. Schmid, M. Miller, G. Doyle, C. Jones, D. LaBrake, Step and flash imprint lithography template fabrication for emerging market applications, in Proceedings of the SPIE, vol. 6607 (2007), p. 66070T
108. T. Ogawa, S. Takei, B.M. Jacobsson, R. Deschner, W. Bell, M.W. Lin, Y. Hagiwara, M. Hanabata, C.G. Willson, Planarizing material for reverse-tone step and flash imprint lithography, in Proceedings of the SPIE 7637, (2010), p. 763708
109. N. Chaix, C. Gourgon, C. Perret, S. Landis, T. Leveder, Nanoimprint lithography processes on 200 mm Si wafer for optical application: residual thickness etching anisotropy. J. Vac. Sci. Technol. B 25, 2346–2351(2007)
110. 2 reactive ion etching pattern transfer step in multilevel lithography. Polym. Eng. Sci. 29(13), 878–881 (1989)
111. Y. Tsuji, M. Yanagisawa, H. Yoshinaga, K. Hiratsuka, Study of reactive ion etching for reverse tone nanoimprint process. J. Phys. Conf. Ser. 191, 012010 (2009)
112. D.L. Olynick, J. Alexander Liddle, B.D. Harteneck, S. Cabrini, I.W. Rangelow, Nanoscale pattern transfer for templates, NEMs, and nano-optics, in Proceedings of the SPIE6462, vol. 64620J (2007)
113. S.Y. Chou, P.R. Krauss, Imprint lithography with sub-10 nm feature size and high throughput. Microelectron. Eng. 35, 237–240 (1997)
114. H. Schift, R.W. Jaszewski, C. David, J. Gobrecht, Nanostructuring of polymers and fabrication of interdigitated electrodes by hot embossing lithography. Microelectron. Eng. 46, 121–124 (1999)
115. D. Makarov, L. Baraban, I.L. Guhr, J. Boneberg, H. Schift, J. Gobrecht, G. Schatz, P. Leiderer, M. Albrecht, Arrays of magnetic nanoindentations with perpendicular anisotropy. Appl. Phys. Lett. 90(9), 093117 (2007)
116. P. Carlberg, M. Graczyk, E.-L. Sarwe, I. Maximov, M. Beck, L. Montelius, Lift-off process for nanoimprint lithography. Microelectron. Eng. 67–68, 203–207 (2003)
117. C.-L. Wu, C.-K. Sung, P.-H. Yao, C.-H. Chen, Sub-15 nm linewidth gratings using roll-to-roll nanoimprinting and plasma trimming to fabricate flexible wire-grid polarizers with low colour shift. Nanotechnology 24, 265301 (2013)
118. T. Borzenko, M. Tormen, G. Schmidt, L.W. Molenkamp, H. Janssen, A polymer bonding process for nanolithography. Appl. Phys. Lett. 79(14), 2246–2248 (2001)
119. X.D. Huang, L.-R. Bao, X. Cheng, L.J. Guo, S.W. Pang, A.F. Yee, Reversal imprinting by transferring polymer from mold to substrate. J. Vac. Sci. Technol. B 20, 2872–2876 (2002)
120. N. Kehagias, V. Reboud, G. Chansin, M. Zelsmann, C. Jeppesen, C. Schuster, M. Kubenz, F. Reuther, G. Gruetzner, C.M. Sotomayor Torres, Reverse-contact UV nanoimprint lithography for multilayered structure fabrication. Nanotechnology 18, 175303 (2007)
121. C. Moormann, N. Koo, J. Kim, U. Plachetka, F. Schlachter, C. Nowak, Liquid transfer nanoimprint replication on non-flat surfaces for optical applications. Microelectron. Eng. 100, 28–32 (2012)
122. T. Senn, Ch. Waberski, J. Wolf, J.P. Esquivel, N. Sabaté, B. Löchel, 3D structuring of polymer parts using thermoforming processes. Microelectron. Eng. 88, 11–16 (2011)
123. S.Y. Chou, M.S. Wei, P.R. Krauss, P.B. Fischer, Single-domain magnetic pillar array of 35 nm diameter and 65 Gbits/in. 2 density for ultrahigh density quantum magnetic storage. J. Appl. Phys. 76(10), 6673–6675 (1994)
124. J. Lille, K. Patel, R. Ruiz, T.-W. Wu, H. Gao, L. Wan, G. Zeltzer, E. Dobisz, T.R. Albrecht, Imprint lithography template technology for bit patterned media (BPM), in Proceedings of the SPIE 8166, Photomask Technology, (2011), p. 816626
125. L. Wan, R. Ruiz, H. Gao, K.C. Patel, J. Lille, G. Zeltzer, E.A. Dobisz, A. Bogdanov, P.F. Nealey, T.R. Albrecht, Fabrication of templates with rectangular bits on circular tracks by combining block copolymer directed self-assembly and nanoimprint lithography. J. Micro/Nanolithogr. MEMS MOEMS 11(3), 031405 (2012)
126. R.A. Griffiths, A. Williams, C. Oakland, J. Roberts, A. Vijayaraghavan, T. Thomson, Directed self-assembly of block copolymers for use in bit patterned media fabrication. J. Phys. D Appl. Phys. 46, 503001 (2013)
127. S.-W. Ahn, K.-D. Lee, J.-S. Kim, S.H. Kim, J.-D. Park, S.-H. Lee, P.-W. Yoon, Fabrication of a 50 nm half-pitch wire grid polarizer using nanoimprint lithography. Nanotechnology 16, 1874–1877 (2005)
128. F. Meng, G. Luo, I. Maximov, L. Montelius, J. Chu, H. Xu, Fabrication and characterization of bilayer metal wire-grid polarizer using nanoimprint lithography on flexible plastic substrate. Microelectron. Eng. 88, 3108–3112 (2011)
129. N.C. Lindquist, P. Nagpa, K.M. McPeak, D.J. Norris, S.-H. Oh, Engineering metallic nanostructures for plasmonics and nanophotonics. Rep. Prog. Phys. 75, 036501 (2012)
130. L. Wang, H. Schift, J. Gobrecht, Y. Ekinci, P.M. Kristiansen, H.H. Solak, K. Jefimovs, High-throughput fabrication of compact and flexible bilayer nanowire grid polarizers for deep-ultraviolet to infrared range. J. Vac. Sci. Technol. B 32, 031206 (2014)
131. R. Ji, M. Hornung, M.A. Verschuuren, R. van de Laar, J. van Eekelen, U. Plachetka, M. Moeller, C. Moormann, UV enhanced substrate conformal imprint lithography (UV-SCIL) technique for photonic crystals patterning in LED manufacturing. Microelectron. Eng. 87(5–8), 963–967 (2010)
132. M.A. Verschuuren, P. Gerlach, H.A. van Sprang, A. Polman, Improved performance of polarization-stable VCSELs by monolithic sub-wavelength gratings produced by soft nano-imprint lithography. Nanotechnology 22, 505201 (2011)
133. Y.-C. Lee, S.-C. Yeh, Y.-Y. Chou, P.-J. Tsai, J.-W. Pan, H.-M. Chou, C.-H. Hou, Y.-Y. Chang, M.-S. Chu, C.-H. Wu, C.-H. Ho, High-efficiency InGaN-based LEDs grown on patterned sapphire substrates using nanoimprinting technology. Microelectron. Eng. 105, 86–90 (2013)
134. L. Cui, J.-C. Han, G.-G. Wang, H.-Y. Zhang, R. Sun, L.-H. Li, Large-scale fabrication of nanopatterned sapphire substrates by annealing of patterned Al thin films by soft UV-nanoimprint lithography. Nanoscale Res. Lett. 8, 472–477 (2013)
135. H. Schift, S. Park, C.-G. Choi, C.-S. Kee, S.-P. Han, K.-B. Yoon, J. Gobrecht, Fabrication process for polymer photonic crystals using nanoimprint lithography. Nanotechnology 16, S261–S265 (2005)
136. M.D. Stewart, J.T. Wetzel, G.M. Schmid, F. Palmieri, E. Thompson, E.K. Kim, D. Wang, K. Sotodeh, K. Jen, S.C. Johnson, J. Hao, M.D. Dickey, Y. Nishimura, R.M. Laine, D.J. Resnick, C.G. Willson, Direct imprinting of dielectric materials for dual damascene processing, in Proceedings of the SPIE 5751, (2005), pp. 210–218
137. H.-J. Kim, M. Almanza-Workman, B. Garcia, O. Kwon, F. Jeffrey, S. Braymen, J. Hauschildt, K. Junge, D. Larson, D. Stieler, A. Chaiken, B. Cobene, R. Elder, W. Jackson, M. Jam, A. Jeans, H. Luo, P. Mei, C. Perlov, C. Taussig, Roll-to-roll manufacturing of electronics on flexible substrates using self-aligned imprint lithography (SAIL). J. Soc. Inf. Disp. 17(11), 963–970 (2009)
138. J.M. Fedeli, L. Di Cioccio, D. Marris-Morini, L. Vivien, R. Orobtchouk, P. Rojo-Romeo, C. Seassal, F. Mandorlo, Development of silicon photonics devices using microelectronic tools for the integration on top of a CMOS wafer. Adv. Opt. Technol. 2008, 412518 (2008)
139. I. Bergmair, B. Dastmalchi, M. Bergmair, A. Saeed, W. Hilber, G. Hesser, C. Helgert, E. Pshenay-Severin, T. Pertsch, E.B. Kley, U. Hübner, N.H. Shen, R. Penciu, M. Kafesaki, C.M. Soukoulis, K. Hingerl, M. Muehlberger, R. Schoeftner, Single and multilayer metamaterials fabricated by nanoimprint lithography. Nanotechnology 22, 325301 (2011)
140. X. Wang, A. Albrecht, H.H. Mai, C. Woidt, T. Meinl, M. Hornung, M. Bartels, H. Hillmer, High resolution 3D nanoimprint technology: template fabrication, application in Fabry–Pérot-filter-array-based optical nanospectrometers. Microelectron. Eng. 110, 44–51 (2013)
141. L. Gao, K. Shigeta, A. Vazquez-Guardado, C.J. Progler, G.R. Bogart, J.A. Rogers, D. Chanda, Nanoimprinting techniques for large-area three-dimensional negative index metamaterials with operation in the visible and telecom bands. ACS Nano 8(6), 5535–5542 (2014)
142. R. Hensel, A. Finn, R. Helbig, H.-G. Braun, C. Neinhuis, W.-J. Fischer, C. Werner, Biologically inspired omniphobic surfaces by reverse imprint lithography. Adv. Mater. 26(13), 2029–2033 (2014)
143. W. Wu, M. Hu, F.S. Ou, Z.Y. Li, R.S. Williams, Cones fabricated by 3D nanoimprint lithography for highly sensitive surface enhanced Raman spectroscopy. Nanotechnology 21, 255502 (2010)
144. N. Gadegaard, K. Seunarine, D.J.A. Smith, D.O. Meredith, C.D.W. Wilkinson, M.O. Riehle, A hybrid three-dimensional nanofabrication method for producing vascular tissue engineering scaffold. Jpn. J. Appl. Phys. 47, 7415–7419 (2008)
145. I. Fernandez-Cuesta, A.L. Palmarelli, X. Liang, J. Zhang, S. Dhuey, D. Olynick, S. Cabrini, Fabrication of fluidic devices with 30 nm nanochannels by direct imprinting. J. Vac. Sci. Technol. B 29(6), 06F801-1/7 (2011)
146. A. Schleunitz, M. Vogler, I. Fernandez-Cuesta, H. Schift, G. Gruetzner, Innovative and tailor-made resist and working stamp materials for advancing NIL-based production technology. J. Photopolym. Sci. Technol. (Jpn.) 26(1), 119–124 (2013)
147. R. Kirchner, V.A. Guzenko, M. Rohn, E. Sonntag, M. Muehlberger, I. Bergmair, H. Schift, Bio-inspired 3D funnel structures made by grayscale electron-beam patterning and selective topography equilibration. Microelectron. Eng. 141, 107–111 (2015)
148. P. Urwyler, H. Schift, J. Gobrecht, O. Häfeli, M. Altana, F. Battiston, B. Müller, Surface patterned polymer micro-cantilever arrays for sensing. Sens. Actuators A 172(1), 2–8 (2011)
149. J. Söchtig, H. Schift, P.D. Patterson, S. Westenhöfer, Replicated diffractive optical lens components for laser-diode to fiber coupling in optical bench arrangements, in Proceedings of the SPIE 3226, (1997), pp. 44–55
150. T. Mäkelä, T. Haatainen, Roll-to-roll pilot nanoimprinting process for backlight devices. Microelectron. Eng. 97, 89–91 (2012)
151. T. Mäkelä, T. Haatainen, J. Ahopelto, Pilot production of photonic devices by roll-to-roll nanoimprinting. J. Photopolym. Sci. Technol. 25(2), 227–228 (2012)
152. C.M. Sotomayor-Torres, J. Ahopelto, Position Paper on Nanophotonics and Nanophononics, NanoICT. Phantoms Foundation, Madrid, Spain. http://www.phantomsnet.net/
153. Kindle Paperwhite, 6” High Resolution Display, Kindle Paperwhite—Released 2012, http://www.amazon.com/Kindle-Paperwhite-Touch-light/dp/B007OZNZG0. Accessed 12 Dec 2014
154. J. Hruska, ExtremeTech, Electronics, Amazon sheds new light on Kindle Paperwhite display, 1 Oct 2012, http://www.extremetech.com/electronics/137158-amazon-sheds-new-light-on-kindle-paperwhite-display. Accessed 12 Dec 2014
155. The New York Times, Business Day Technology, Published: December 26, 2012, Light reading: how the Kindle Paperwhite works, http://www.nytimes.com/interactive/2012/12/26/technology/light-reading.html. Accessed 12 Dec 2014
156. K. Rinko, Ultrathin Lighting Element, International Publication Number WO2005/107363 A2, priority date 30 April 2004
157. K. Rinko, Light Outcoupling Structure for a Lighting Device, International Publication Number WO 2008/053078 A1, 2006, priority date 31 October
158. T. Buß, J. Teisseire, S. Mazoyer, C.L.C. Smith, M.B. Mikkelsen, A. Kristensen, E. Søndergård, Controlled angular redirection of light via nanoimprinted disordered gratings. Appl. Opt. 52(4), 709–716 (2013)
159. S. Klammt, A. Neyer, H.F.O. Mueller, Microoptics for efficient redirection of sunlight. Appl. Opt. 51, 2051–2056 (2012)
160. H. Schift, C. Spreu, M. Saidani, M. Bednarzik, J. Gobrecht, A. Klukowska, F. Reuther, G. Gruetzner, H.H. Solak, Transparent hybrid polymer stamp copies with sub-50 nm resolution for thermal and UV-nanoimprint lithography. J. Vac. Sci. Technol. B 27(6), 2846–2849 (2009)
161. A. Schleunitz, C. Spreu, T. Haatainen, A. Klukowska, H. Schift, Fabrication of mesas with micro- and nanopatterned surface relief used as working stamps for step & stamp imprint lithography. J. Vac. Sci. Technol. B 28(6), C6M37–C6M40 (2010)
162. T. Haatainen, T. Mäkelä, A. Schleunitz, G. Grenci, M. Tormen, Integration of rotated 3-D structures into pre-patterned PMMA substrate using step & stamp nanoimprint lithography. Microelectron. Eng. 98, 180–183 (2012)
163. G. Grenci, E. Sovernigo, A.Z. Khokhar, N. Gadegaard, M. Prasciolu, M. Tormen, Microfabrication of sharp blazed gratings by a two-step height amplification process based on soft and deep X-ray lithography. Sens. Actuators A 205, 111–118 (2014)
164. M. Li, L. Chen, S.Y. Chou, Direct three-dimensional patterning using nanoimprint lithography. Appl. Phys. Lett. 78(21), 3322–3324 (2001)
165. P. Batude, M. Vinet, B. Previtali, C. Tabone, C. Xu, J. Mazurier, O. Weber, F. Andrieu, L. Tosti, L. Brevard, B. Sklenard, P. Coudrain, S. Bobba, H. Ben Jamaa, P-E. Gaillardon, A. Pouydebasque, O. Thomas, C. Le Royer, J.-M. Hartmann, L. Sanchez, L. Baud, V. Carron, L. Clavelier, G. De Micheli, S. Deleonibus, O. Faynot, T. Poiroux, Advances, challenges and opportunities in 3D CMOS sequential integration, in IEEE Electron Devices Meeting (IEDM) (2011)
166. Z. Liu, D.G. Bucknall, M.G. Allen, Inclined nanoimprinting lithography for 3D nanopatterning. Nanotechnology 22, 225302 (2011)