Analysis and characterization of demolding of hot embossed polymer microstructures

Journal of Micromechanics and Microengineering

Volumn 21, Issue 8, 2011, Pages

  Dirckx, Matthew E ^a   Hardt, David E ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYSIS AND CHARACTERIZATION; DEMOLDING; FINITE ELEMENT SIMULATIONS; HOT-EMBOSSING; LAB-ON-A-CHIP; MATERIAL PROPERTY; MICROMOLDING; MINIMUM VALUE; MOLD PATTERN; OTHER APPLICATIONS; POINT-OF-CARE DIAGNOSTICS; POLYMER MICROSTRUCTURES; SIDE-WALL FRICTION; TEST METHOD;

ADHESION; FRICTION; INJECTION MOLDING; MICROSTRUCTURE; MOLDS;

FINITE ELEMENT METHOD;

EID: 79961225715     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/8/085024     Document Type: Article

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