Optimization of demolding temperature for throughput improvement of nanoimprint lithography

Microelectronic Engineering

Volumn 84, Issue 5-8, 2007, Pages 953-957

  Leveder, T ^a   Landis, S ^a   Davoust, L ^b   Chaix, N ^c  

^a CEA LETI   (France)

^b Centre National de la Recherche Scientifique   (France)

^c CNRS   (France)

Author keywords

Demolding modelisation; Nanoimprint lithography; Patterns reflow; Throughput optimization

Indexed keywords

ATOMIC FORCE MICROSCOPY; FLOW PATTERNS; OPTIMIZATION; THERMAL EFFECTS; THERMOPLASTICS;

DEMOLDING TEMPERATURE; HOT EMBOSSING LITHOGRAPHY; THROUGHPUT OPTIMIZATION;

NANOIMPRINT LITHOGRAPHY;

FLOW MEASUREMENT; LITHOGRAPHY; OPTIMIZATION; THERMOPLASTICS;

EID: 34247578691     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.01.066     Document Type: Article

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