Measurement of demolding forces in full wafer thermal nanoimprint

Microelectronic Engineering

Volumn 85, Issue 5-6, 2008, Pages 907-909

  Trabadelo, Vera ^a,b   Schift, Helmut ^a   Merino, Santos ^b   Bellini, Sandro ^c   Gobrecht, Jens ^a  

^a PAUL SCHERRER INSTITUTE   (Switzerland)

^b IK4 TEKNIKER   (Spain)

^c ETH ZURICH   (Switzerland)

Author keywords

Demolding force; Force history; Nanoimprint lithography

Indexed keywords

FORCE CONTROL; MOLDING; THERMAL EFFECTS;

DEMOLDING FORCES; PATTERN DESIGN; THERMAL NANOIMPRINT;

NANOIMPRINT LITHOGRAPHY;

FORCE; LITHOGRAPHY; MOLDING;

EID: 44149117259     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.01.086     Document Type: Article

References (4)

1. Merino S., Schift H., Retolaza A., and Haatainen T. Microelectron. Eng. 84 (2007) 958-962
2. Hirai Y., Yoshida S., and Takagi N. J. Vac. Sci. Technol. B 21 6 (2003) 2765-2770
3. Schift H., Park S., Choi C.-G., Kee C.-S., Han S.-P., Yoon K.-B., and Gobrecht J. Nanotechnology 16 (2005) S261-S265
4. Schift H., Saxer S., Park S., Padeste C., Pieles U., and Gobrecht J. Nanotechnology 16 (2005) S171-S175