Reversal imprinting by transferring polymer from mold to substrate

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 20, Issue 6, 2002, Pages 2872-2876

  Huang, X D ^a   Bao, L R ^b   Cheng, X ^b   Guo, L J ^b   Pang, S W ^b   Yee, A F ^a,b  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

^b UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GLASS TRANSITION; PRESSURE EFFECTS; SPIN COATING; SUBSTRATES; SURFACE PHENOMENA; THERMAL EFFECTS;

IMPRINTING TECHNIQUE; SURFACE PLANARIZATION; TRANSFERRING POLYMER;

LITHOGRAPHY;

EID: 0036873952     PISSN: 0734211X     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1523404     Document Type: Article

References (12)

1. S. Y. Chou, P. R. Krauss, and P. J. Renstrom, Science 272, 85 (1996).
2. S. Y. Chou, P. R. Krauss, W. Zhang, L. J. Guo, and L. Zhuang, J. Vac. Technol. B 15, 2897 (1997).
3. S. Y. Chou and P. R. Krauss, Microelectron. Eng. 35, 237 (1997).
4. B. Heidari, I. Maximov, and L. Montelius, J. Vac. Sci. Technol. B 18, 3557 (2000).
5. A. Lebib, Y. Chen, J. Bourneix, F. Carcenac, E. Cambril, L. Couraud, and H. Launois, Microelectron. Eng. 46, 319 (1999).
6. T. Borzenko, M. Tormen, G. Schmidt, L. W. Molenkamp, and H. Janssen, Appl. Phys. Lett. 79, 2246 (2001).
7. S. Y. Chou, U.S. Patent No. 6,309,580 (2001).
8. L. J. Heyderman, H. Schift, C. David, J. Gobrecht, and T. Schweizer, Microelectron. Eng. 54, 229 (2000).
9. H. C. Scheer, H. Schulz, T. Hoffmann, and C. M. S. Torres, J. Vac. Sci. Technol. B 16, 3917 (1998).
10. S. Zankovych, T. Hoffmann, J. Seekamp, J. U. Bruch, and C. M. S. Torres, Nanotechnology 12, 91 (2001).
11. F. Gottschalch, T. Hoffmann, C. M. S. Torres, H. Schulz, and H. Scheer, Solid-State Electron. 43, 1079 (1999).
12. T. Nishino, M. Meguro, K. Nakamae, M. Matsushita, and Y. Ueda, Langmuir 15, 4321 (1999).