Investigation of the separation of 3D-structures with undercuts

Microelectronic Engineering

Volumn 84, Issue 5-8, 2007, Pages 1007-1010

  Mollenbeck S ^a   Bogdanski, N ^a   Wissen, M ^a   Scheer, H C ^a   Zajadacz, J ^b   Zimmer, K ^b  

^a UNIVERSITY OF WUPPERTAL   (Germany)

^b LEIBNIZ INSTITUTE OF SURFACE ENGINEERING IOM   (Germany)

Author keywords

3D structures; Hot embossing; PDMS; Undercuts

Indexed keywords

SPIN COATING; SUBSTRATES; SURFACE PROPERTIES; THIN FILMS;

3D-STRUCTURES; HOT EMBOSSING; PDMS; UNDERCUTS;

POLYDIMETHYLSILOXANE;

EID: 34247593007     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.01.138     Document Type: Article

References (8)

1. Callies M., et al. Micoelectron. Eng. 78-79 (2005) 100
2. S. Möllenbeck et al., JVST, 2006, submitted for publication.
3. Bogdanski N., et al. Microelectron. Eng. 73-74 (2004) 190
4. Roos N., et al. Proc. SPIE 4688 (2002) 232
5. Seemann R., et al. New J. Phys. 6 (2004) 111
6. Seemann R., et al. PNAS 102 (2005) 1849
7. Bogdanski N., et al. J. Vac. Sci. Technol. B 24 (2006) 2998
8. Reddy S., et al. Phys. Fluids 17 (2005) 122104