3D structuring of polymer parts using thermoforming processes

Microelectronic Engineering

Volumn 88, Issue 1, 2011, Pages 11-16

  Senn, T ^a   Waberski, Ch ^a   Wolf, J ^a   Esquivel, J P ^b   Sabate N ^b   Lochel B ^a  

^a HAHN MEITNER INSTITUT   (Germany)

^b INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

Author keywords

3D structuring; Micro and nanointegration; Soft lithography; UV casting

Indexed keywords

3D STRUCTURING; BLAZED ANGLE; BLAZED GRATING; HIGH TEMPERATURE; HOT-EMBOSSING; HYDROPHOBIC AND HYDROPHILIC; MICRO AND NANOINTEGRATION; MICRO FLUIDIC SYSTEM; MOLD INSERTS; MOTH-EYE STRUCTURE; PARAMETER OPTIMIZATION; PATTERN FIDELITY; POLYDIMETHYLSILOXANE PDMS; POLYMER MATERIALS; PORE DIAMETERS; REPLICA-MOLDING PROCESS; SOFT LITHOGRAPHY; STRUCTURED POLYMERS; THREE DIMENSIONAL (3D) STRUCTURES; UV-CASTING;

DIE CASTING INSERTS; LITHOGRAPHY; MICROCHANNELS; MOLDING; MOLDS; POLYMERS; THERMOFORMING;

THREE DIMENSIONAL;

EID: 78049234618     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2010.08.003     Document Type: Article

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