The use of automatic demolding in nanoimprint lithography processes

Microelectronic Engineering

Volumn 84, Issue 5-8, 2007, Pages 958-962

  Merino, S ^a   Schift, H ^b   Retolaza, A ^a   Haatainen, T ^c  

^a IK4 TEKNIKER   (Spain)

^b PAUL SCHERRER INSTITUTE   (Switzerland)

^c VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

Demolding; Molecular weight; Nanoimprint lithography; Thermoplastic

Indexed keywords

MOLECULAR WEIGHT; THERMOPLASTICS;

DEMOLDING; MANUAL DEMOLDING; SLOW DEMOLDING;

NANOIMPRINT LITHOGRAPHY;

LITHOGRAPHY; MOLECULAR WEIGHT; THERMOPLASTICS;

EID: 34247580214     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.01.023     Document Type: Article

References (7)

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