Study of the demolding process - Implications for thermal stress, adhesion and friction control

Journal of Micromechanics and Microengineering

Volumn 17, Issue 1, 2007, Pages 9-19

  Guo, Yuhua ^a   Liu, Gang ^a   Xiong, Yin ^a   Tian, Yangchao ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COMPUTER SIMULATION; FRICTION; INTERFACIAL ENERGY; MICROSTRUCTURE; POLYMERS; THERMAL STRESS;

DEMOLDING PROCESS; FRICTION FORCES; HOT EMBOSSING MACHINES; SHRINKAGE DIFFERENCES;

PLASTICS MOLDING;

EID: 33947588123     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/17/1/002     Document Type: Article

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