Planarizing material for reverse-tone step and flash imprint lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7637, Issue , 2010, Pages

  Ogawa, Tsuyoshi ^a   Takei, Satoshi ^b   Jacobsson, B Michael ^a   Deschner, Ryan ^a   Bell, William ^a   Lin, Michael W ^a   Hagiwara, Yuji ^a   Hanabata, Makoto ^b   Willson, C Grant ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^b NISSAN CHEMICAL INDUSTRIES LTD   (Japan)

Author keywords

epoxy; imprint; Planarization; S FIL R; siloxane; UV cure

Indexed keywords

ETCH PROCESS; ETCH SELECTIVITY; FUNCTIONALIZED; HIGH SILICON CONTENT; IMPRINT TOOLS; INDUSTRIAL PROCESSS; LOW VAPOR PRESSURES; LOW VISCOSITY; MOLECULAR IMPRINT; NOVEL MATERIALS; PATTERNED SUBSTRATES; PLANARIZATION; PLANARIZING; STEP AND FLASH IMPRINT LITHOGRAPHY; SYNTHETIC ROUTES; UV CURE;

COATED MATERIALS; CURING; SILICON; VISCOSITY;

NANOIMPRINT LITHOGRAPHY;

EID: 77953298860     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.846430     Document Type: Conference Paper

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