Direct imprinting of dielectric materials for dual damascene processing

Progress in Biomedical Optics and Imaging - Proceedings of SPIE

Volumn 5751, Issue I, 2005, Pages 210-218

  Stewart, Michael D ^a,b   Wetzel, Jeffery T ^c   Schmid, Gerard M ^d   Palmieri, Frank ^a   Thompson, Ecron ^b   Kim, Eui Kyoon ^a   Wang, David ^b   Sotodeh, Ken ^c   Jen, Kane ^a   Johnson, Stephen C ^a   Hao, Jianjun ^a   Dickey, Michael D ^a   Nishimura, Yukio ^a   Laine, Richard M ^e   Resnick, Douglas J ^f   Willson, C Grant ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^b MOLECULAR IMPRINTS INC   (United States)

^c ATDF Inc   (United States)

^d LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^e UNIVERSITY OF MICHIGAN   (United States)

^f MOTOROLA INC   (United States)

Author keywords

Dual damascene; Interconnect; Multi tier template; Nanoimprint lithography; SFIL

Indexed keywords

DUAL DAMASCENE; INTERCONNECTS; MULTI-TIER TEMPLATE; NANOIMPRINT LITHOGRAPHY;

FABRICATION; LARGE SCALE SYSTEMS; PATTERN RECOGNITION; PHOTOLITHOGRAPHY; TRANSISTORS;

DIELECTRIC MATERIALS;

EID: 24644465507     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.599977     Document Type: Conference Paper

References (12)

1. Colburn, M.; Johnson, S.; Stewart, M.; Damle, S.; Bailey, T. C.; Choi, B.; Wedlake, M.; Michaelson, T.; Sreenivasan, S. V.; Ekerdt, J.; Willson, C. G., Proc. SPIE- Int. Soc. Opt. Eng. 1999, 3676, 379.
2. Li, M.; Wang, J.; Zhuang, L.; Chou, S. Y., Appl. Phys. Lett. 2000, 76, 673.
3. Seekamp, J.; Zankovych, S.; Helfer, A.H.; Maury, P.; Sotomayor-Torres, C.M.; Boettger, G.; Liguda, C; Eich, M.; Heidari, B.; Montelius, L.; Ahopelto, J. Nanotechnology 2002, 13, 581-586.
4. Yu, Z.; Wu, W.; Chen, L.; Chou, S.Y., J. Vac. Sci. Technol. B. 2001, 19, 2816.
5. Rolland, J.P.; Van Dam, R.M.; Schorzman, D.A.; Quake, S.R.; DeSimone, J.M., J. Am. Chem. Soc.2004, 126, 2322-2323.
6. McMackin, I.; Choi, J.; Schumaker, P.; Nguyen, V.; Xu, F.; Thompson, E.; Babbs, D.; Sreenivasan, S. V.; Watts, M.; Schumaker, N., Proc.SPIE-Int. Soc. Opt Eng. 2004, 5374, 222-231.
7. McMackin, I.; Schumaker, P.; Babbs, D.; Choi, J.; Collison, W.; Sreenivasan, S. V.; Schumaker, N.E.; Watts, M.P.C.; Voisin, R.D., Proc.SPIE-Int. Soc. Opt. Eng. 2003, 5037, 178-186.
8. Johnson, S.; Resnick, D. J.; Mancini, D.; Nordquist, K.; Dauksher, W. J.; Gehoski, K.; Baker, J H.; Dues, L.; Hooper, A.; Bailey, T.C.; Sreenivasan, S.V.; Ekerdt, J.G.; Willson, C.G., Microelectron. Eng. 2003, 67-68, 221-228.
9. Resnick, D.J.; Dauksher, W. J.; Mancini, D.; Nordquist, K.J.; Bailey, T.C.; Johnson, S.; Stacey, N.; Ekerdt, J.G.; Willson, C.G.; Sreenivasan, S.V.; Schumaker, N., J. Vac. Sci. Technol B, 2003, 21, 2624.
10. S. Kondo, Y. Anzai, M. Terao, D. Ryuzaki, D. Kodama, T. Furusawa. "An Imprint-Damascene Process for Cu/low-k Interconnects", Proceedings of ULSI, 2003, 17, 537-542.
11. Zhang, C.; Laine, R.M., J. Am. Chem. Soc., 2000, 122, 6979-6988.
12. Seung, J.C.; Kim, G.; Laine, R.M., Macromolecules, 2004, 37, 99-109.