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Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 26, Issue 6, 2008, Pages 2399-2403

Experimental and numerical analyses on recovery of polymer deformation after demolding in the hot embossing process

(7) Takagi, Hideki a Takahashi, Masaharu a Maeda, Ryutaro a Onishi, Yuki b Iriye, Yasuroh b Iwasaki, Takuya b Hirai, Yoshihiko c

a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST (Japan)

b MIZUHO INFORMATION AND RESEARCH INSTITUTE (Japan)

c Osaka Prefecture University (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLING; DEFORMATION; FINITE ELEMENT METHOD; GLASS TRANSITION; OPTIMIZATION; PHOTORESISTS; SHEET MOLDING COMPOUNDS; SYSTEMS ENGINEERING;

DEMOLDING; EXPERIMENTAL AND NUMERICAL ANALYSIS; FINITE ELEMENT SIMULATIONS; GENERALIZED MAXWELL MODELS; GLASS TRANSITION TEMPERATURES; HIGH THROUGHPUTS; HIGHER TEMPERATURES; HOT EMBOSSING PROCESSES; LONG TIMES; NUMERICAL SIMULATION METHODS; NUMERICAL SIMULATIONS; POLYMER DEFORMATIONS; POWERFUL TOOLS; PROCESS CYCLES; RECOVERY PHENOMENONS; VISCOELASTIC BODIES;

POLYMERS;

EID: 57249103620 PISSN: 10711023 EISSN: None Source Type: Journal
DOI: 10.1116/1.2987956 Document Type: Article

Times cited : (16)

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