Moulding of arrowhead structures

Microelectronic Engineering

Volumn 86, Issue 4-6, 2009, Pages 608-610

  Mollenbeck S ^a   Bogdanski, N ^a   Scheer, H C ^a   Zajadacz, J ^b   Zimmer, K ^b  

^a UNIVERSITY OF WUPPERTAL   (Germany)

^b LEIBNIZ INSTITUTE OF SURFACE ENGINEERING IOM   (Germany)

Author keywords

3D structures; Moulding; PDMS; Undercuts

Indexed keywords

3D-STRUCTURES; CHARACTERISATION; DIFFERENT GEOMETRIES; MATERIAL PROPERTIES; MOULDING; PDMS; PREPOLYMER; UNDERCUTS;

MICROCHANNELS; POLYMERS; SILICONES;

MOLDING;

EID: 65549130419     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.12.035     Document Type: Article

References (8)

1. Odom T.W., Love J.C., Wolfe D.B., Paul K.E., and Whitesides G.M. Langmuir 18 (2002) 5314-5320
2. Munnik F., Benninger F., Mikhailov S., Bertsch A., Renaud P., Lorenz H., and Gmür M. Microelectron. Eng. 67-68 (2003) 96-103
3. Bogdanski N., Schulz H., Wissen M., Scheer H.-C., Zajadacz J., and Zimmer K. Microelectron. Eng. 73-74 (2004) 190-195
4. Möllenbeck S., Bogdanski N., Wissen M., Scheer H.-C., Zajadacz J., and Zimmer K. J. Vac. Sci. Technol. B 25 1 (2007) 247-251
5. Möllenbeck S., Bogdanski N., Wissen M., Scheer H.-C., Zajadacz J., and Zimmer K. Microelectron. Eng. 84 (2007) 1007-1010
6. Möllenbeck S., Bogdanski N., Wissen M., Scheer H.-C., Zajadacz J., and Zimmer K. Microelectron. Eng. 85 (2008) 881-885
7. Scheer H.-C., Möllenbeck S., Bogdanski N., Häfner W., and Fidler A. J. Vac. Sci. Technol. B 26 6 (2008) 2380-2384
8. Seemann R., Kramer E.J., and Lange F.F. New J. Phys. 6 (2004) 111-120