Electromigration and thermomigration in Pb-free flip-chip solder joints

Annual Review of Materials Research

Volumn 40, Issue , 2010, Pages 531-555

  Chen, Chih ^a   Tong, H M ^b   Tu, K N ^c  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

current stressing; diffusion; Joule heating; microelectronic packaging; reliability; thermal gradient; underbump metallization

Indexed keywords

CURRENT CROWDING; CURRENT-STRESSING; DISSOLUTION RATES; ELECTRONIC PACKAGING INDUSTRY; ENVIRONMENTAL CONCERNS; FLIP CHIP; FLIP CHIP TECHNOLOGIES; MICROELECTRONIC PACKAGING; PB FREE SOLDERS; PB-FREE; PB-FREE SOLDER BUMP; SNPB SOLDER; SOLDER BUMP; SOLDER JOINTS; THERMOMIGRATION; UNDER BUMP METALLIZATION; UNIQUE FEATURES;

CHIP SCALE PACKAGES; DISSOLUTION; ELECTROMIGRATION; FLIP CHIP DEVICES; HEATING; JOULE HEATING; LEAD; METALLIZING; MICROELECTRONICS; RELIABILITY; SOLDERING ALLOYS; THERMAL GRADIENTS; THERMOANALYSIS;

TIN;

EID: 77957003623     PISSN: 15317331     EISSN: None     Source Type: Book Series    
DOI: 10.1146/annurev.matsci.38.060407.130253     Document Type: Article

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