Thermomigration and electromigration in Sn58Bi solder joints

Journal of Applied Physics

Volumn 105, Issue 9, 2009, Pages

  Gu, Xin ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ANODE SIDE; ATOMIC FLUXES; CROSS INTERACTIONS; DIRECT CURRENT; ELECTRON FLOW; FINITE ELEMENT SIMULATIONS; INTERMETALLIC COMPOUNDS; NI ATOMS; NI WIRES; SOLDER JOINTS; THERMOMIGRATION;

ATOMS; BRAZING; ELECTROMIGRATION; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; THERMOANALYSIS; WELDING; WIRE;

NICKEL;

EID: 67249155765     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3125458     Document Type: Article

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