Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints

Journal of Applied Physics

Volumn 94, Issue 12, 2003, Pages 7560-7566

  Nah, J W ^a   Paik, K W ^a   Suh, J O ^b   Tu, K N ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT CROWDING; ELECTRON FLOW;

CATHODES; COMPOSITE MATERIALS; COPPER; ELECTRIC CURRENTS; ELECTROMIGRATION; ELECTROPLATING; GOLD; INTERFACES (MATERIALS); LEAD; METALLIZING; NICKEL; PHASE TRANSITIONS; SPUTTERING; SUBSTRATES; TIN;

SOLDERED JOINTS;

EID: 0346935270     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1628388     Document Type: Article

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