Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization

Journal of Materials Research

Volumn 22, Issue 3, 2007, Pages 763-769

  Nah, Jae Woong ^a,b   Chen, Kai ^a   Tu, K N ^a   Su, Bor Rung ^c   Chen, Chih ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; CURRENT DENSITY; ELECTROMIGRATION; EUTECTICS; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; METALLIZING; SOLDERED JOINTS;

EUTECTIC SOLDER JOINTS; FLIP-CHIP SOLDER JOINTS; UNDER-BUMP METALLIZATION (UBM);

TIN ALLOYS;

EID: 33947277704     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2007.0084     Document Type: Article

References (13)

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