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Volumn 103, Issue 12, 2008, Pages
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Thermomigration induced degradation in solder alloys
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Author keywords
[No Author keywords available]
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Indexed keywords
ALLOYS;
BRAZING;
DEGRADATION;
ELECTRIC CURRENTS;
METALLIC COMPOUNDS;
MICROSTRUCTURAL EVOLUTION;
POWER ELECTRONICS;
SULFATE MINERALS;
AMERICAN INSTITUTE OF PHYSICS (AIP);
DIFFUSION MODELING;
EVOLUTION (CO);
EXPERIMENTAL DATA;
FULLY COUPLED;
GRAIN COARSENING;
INDUCED DEGRADATION;
ISOTROPIC HARDENINGS;
MICRO STRUCTURAL;
NANO SCALING;
POWER PROCESSING;
SIMULATION RESULTS;
SMALL SIZE;
SOLDER ALLOYS;
SOLDER JOINTS;
STRENGTH DEGRADATION;
TEMPERATURE GRADIENTS;
VISCOPLASTIC MATERIALS;
WELDING;
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EID: 46449091445
PISSN: 00218979
EISSN: None
Source Type: Journal
DOI: 10.1063/1.2943261 Document Type: Article |
Times cited : (39)
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References (46)
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