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Volumn 103, Issue 12, 2008, Pages

Thermomigration induced degradation in solder alloys

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; BRAZING; DEGRADATION; ELECTRIC CURRENTS; METALLIC COMPOUNDS; MICROSTRUCTURAL EVOLUTION; POWER ELECTRONICS; SULFATE MINERALS;

EID: 46449091445     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2943261     Document Type: Article
Times cited : (39)

References (46)
  • 23
    • 46449092605 scopus 로고    scopus 로고
    • Proceedings of the 55th Electronic Components and Technology Conference, (unpublished).
    • C. Basaran, H. Tang, and S. Nie, Proceedings of the 55th Electronic Components and Technology Conference, 2005 (unpublished).
    • (2005)
    • Basaran, C.1    Tang, H.2    Nie, S.3
  • 28
    • 46449120489 scopus 로고    scopus 로고
    • American Society of Mechanical Engineers, EEP.
    • T. Sayama, T. Takayanagi, and T. Mori, American Society of Mechanical Engineers, EEP, 1999.
    • (1999)
    • Sayama, T.1    Takayanagi, T.2    Mori, T.3
  • 32
    • 46449111922 scopus 로고
    • Proceedings of the Physical Society, London, (unpublished).
    • E. O. Hall, Proceedings of the Physical Society, London, 1951 (unpublished).
    • (1951)
    • Hall, E.O.1
  • 39
    • 0031645508 scopus 로고    scopus 로고
    • in Thermal and Thermomechanical Phenomena in Electronic Systems, 1998 ITHERM '98, The Sixth Intersociety Conference on, 205-211.
    • B. Z. Hong, " Thermal fatigue analysis of a Cbga package with lead-free solder fillets.," in Thermal and Thermomechanical Phenomena in Electronic Systems, 1998 ITHERM '98, The Sixth Intersociety Conference on, pp. 205-211 1998.
    • (1998) Thermal Fatigue Analysis of A Cbga Package with Lead-free Solder Fillets
    • Hong, B.Z.1
  • 44
    • 46449136817 scopus 로고    scopus 로고
    • Properties of Lead-Free Solders (available from).
    • T. Siewert, S. Liu, D. R. Smith, and J. C. Madeni, Properties of Lead-Free Solders 2002 (available from http://www.boulder.nist.gov/div853/ lead%20free/part1.html#%201.3).
    • (2002)
    • Siewert, T.1    Liu, S.2    Smith, D.R.3    Madeni, J.C.4
  • 45
    • 46449129541 scopus 로고    scopus 로고
    • Proceedings of the Electronic Components and Technology Conference, (unpublished).
    • K. Seelig and D. Suraski, Proceedings of the Electronic Components and Technology Conference, 2000 (unpublished).
    • (2000)
    • Seelig, K.1    Suraski, D.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.